August, 2014
www.us-
tech.com
Page 79 New Insulated Spring Pins from Mill-Max
Oyster Bay, NY —Mill-Max is introducing a line of discrete, insulated spring-loaded pins. The new line comprises seven different heights of SMT spring pins assembled into a durable, high temper- ature Nylon 46 insulator sleeve. This new series, 807-22-001-30-00X101 (X = 0-6,) utilizes existing Mill-Max spring pins (0965 and 0900-X series) and is the first series produced by the company that is dedicated to be a single-position insulated spring pin terminal. The 807 product is for applications where
electrical isolation is required. It provides insula- tion of the spring pin terminal for situations such as passing through a conductive case or housing, or for isolating the pin from surrounding conduc- tive components or elements. The insulators used on the 807 series are cylindrical in shape with two diameters. The larger diameter, the collar, is 0.094-in. (2.39mm) in diameter and acts as a posi- tive stop as the pin passes through an enclosure.
Teka Intros Press-Fit
Interconnects Warwick, RI — Teka Interconnection Systems, a manufacturer of applica- tion-specific and industry-standard interconnect has introduced a new line of 0.100-in. (2.54mm) spacing Press-Fit PC/104's for the Telecom, Industrial, Military/Aerospace and Automotive Industries. These press-fit solutions utilize
Interplex Industries' proprietary "eye-of-the-needle" technology. This is a proven interconnect technology that eliminates soldering and improves product quality. It allows for the assembly of the company's interconnects with a printed circuit
47th
Microelectronics October 13-16, 2014
International Symposium on Town & Country Resort and Conference Center • San Diego, CA
The uncompressed height range of the series is from 0.100-in. to 0.236-in. (2.54 to 5.99mm) with a
working travel range from 0.012 to 0.0275-in. (0.3 to 0.7mm). The maximum stroke capability range is from 0.024 to 0.055-in. (0.61 to 1.4mm). The 807 series is available in bulk or pack-
aged on tape-and-reel for automated pick-and- place assembly; the insulator sleeve keeps the component stable in the pocket to facilitate the pick and place process. The high temperature nylon 46 insulator is suitable for RoHS soldering processes. The 807 series spring pins are constructed of
precision-machined, gold-plated components and gold-plated beryllium copper springs. The 807-22- 001-30-000101 has a gold-plated stainless steel spring. All are rated at 2amps and have a mechan-
ical life of 1,000,000 cycles. Contact: Mill-Max Mfg. Corp., 190 Pine
Insulated spring pins.
Hollow Rd., PO Box 300, Oyster Bay, NY 11771- 0300 % 516-922-6000 fax: 516-922-9253 Web:
www.mill-max.com
Press-fit connectors.
board's plated-through hole in such a way that an electrical connection is created and maintained without the application of solder. The Interplex press-fit technology has been quali- fied and employed by major automo- tive companies around the world. Stackthrough and non-stack-
through interconnect versions are available in 40 and 64 positions. Custom plating options are avail- able, and the product is RoHS-com- pliant, eliminates hand soldering, and
complies with PC/104
Standards. Applications include con- nector assemblies used in the indus- trial, telecommunication, medical, military and automotive industries. The press-fit PC/104's are in
addition to Teka's self-soldering PC/104's, which also eliminate the need for costly soldering processes
and improve assembly quality. Contact: Teka Interconnection
Systems, 100 Pioneer Avenue, Warwick, RI 02888 % 401-785-4110 fax: 401-781-5730 E-mail:
sales@tekais.com Web:
www.tekais.com
Register Online:
IMAPS2014.org • Early Registration & Hotel Deadline: September 12, 2014
Advance Program Highlights
IMAPS 2014 Focuses on “the Future of Packaging” featuring that all new track!
The most Interposer & 3D Content Under One Roof – 6 sessions and more than 35 speakers on 3D!
Featuring keynotes from Qualcomm, Micron, Jawbone, IPDiA and IBM
The all new Panel Discussion Thursday on “the Future of Packaging”
19 Professional Development Courses Monday & Thursday – all new format Monday!
28 sessions featuring more than 190 papers 2-Day Exhibition (Tues-Weds.)
with more than 100 Exhibit Booths
2nd Annual “Research Lab Corridor” on Exhibit Floor
GBC Luncheon & Market Forum on “Future of Packaging: Mobile & Solar PV”
“Dessert Break” in the exhibit hall on Tuesday afternoon Networking Reception
Wednesday evening in the Hall
Page 1 |
Page 2 |
Page 3 |
Page 4 |
Page 5 |
Page 6 |
Page 7 |
Page 8 |
Page 9 |
Page 10 |
Page 11 |
Page 12 |
Page 13 |
Page 14 |
Page 15 |
Page 16 |
Page 17 |
Page 18 |
Page 19 |
Page 20 |
Page 21 |
Page 22 |
Page 23 |
Page 24 |
Page 25 |
Page 26 |
Page 27 |
Page 28 |
Page 29 |
Page 30 |
Page 31 |
Page 32 |
Page 33 |
Page 34 |
Page 35 |
Page 36 |
Page 37 |
Page 38 |
Page 39 |
Page 40 |
Page 41 |
Page 42 |
Page 43 |
Page 44 |
Page 45 |
Page 46 |
Page 47 |
Page 48 |
Page 49 |
Page 50 |
Page 51 |
Page 52 |
Page 53 |
Page 54 |
Page 55 |
Page 56 |
Page 57 |
Page 58 |
Page 59 |
Page 60 |
Page 61 |
Page 62 |
Page 63 |
Page 64 |
Page 65 |
Page 66 |
Page 67 |
Page 68 |
Page 69 |
Page 70 |
Page 71 |
Page 72 |
Page 73 |
Page 74 |
Page 75 |
Page 76 |
Page 77 |
Page 78 |
Page 79 |
Page 80 |
Page 81 |
Page 82 |
Page 83 |
Page 84