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www.us-
tech.com
August, 2014
Panasonic Debuts Flip Chip Bonder
Rolling Meadows, IL — Panasonic Factory Solutions Company of Amer- ica has introduced a process-flexible flip-chip bonder as part of its high-
work in parallel. This process imme- diately increases bond quality and enhances overall throughput. Supporting up to 300mm (12-
Manufactured in the U.S.A. since 1966
www.westbond.com
1551 S. Harris Court Anaheim, CA 92806 Tel 714·978·1551 Flip chip bonder.
speed, low-cost manufacturing solu- tions for highly advanced devices. Called the MDP-300, the com-
pany's latest bonder combines flip chip, thermosonic, and thermocom- pression bonding in a single, small footprint solution. It includes a syn- chronous head motion that enables the bond head and the dispenser to
Los Angeles Office: 3528 Torrance Blvd., Suite 100
Torrance, CA 90503 Phone: (310) 540-7310 Fax: (310) 540-7930
ce, CA 90503
Phone: (310) 540-7310 Fax: (310) 540-7930
in.) wafer substrates, it can even con-
nect to an SMT machine. Contact: Panasonic Factory So-
lutions Company of America, 5201 Tollview Dr., Rolling Meadows, IL 60008 % 847-637-9600 E-mail: PFSAmarketing@
us.panasonic.com Web:
www.panasonicfa.com
Atlanta Office: 1580 Boggs Rd., #900
Duluth, GA, 30096 Phone: (770) 446-3116 Fax: (770) 446-3118
Duluth, GA, 30096 Phone: (770) 446-3116 Fax: (770) 446-3118
Reliable, Next-Generation Soldering Technique
Main Features
• Great reduction of voids by using N2 reflow and vacuum
res tion of voids by flow and vacuum
• In-line model available for mass production • Special design for highly-reliable performance • Low power consumption • Large capacity flux collection unit
l available for mass production
gn for highly-reliable performance consumption
city flux collection unit
EIGHTECH TECTRON CO., LTD.
M Model: RSV12M-512-RLF Model: RSV12M-512-RLF Visit us at
www.seikausa.com to see more of our products!
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