August, 2014
www.us-
tech.com CyberOptics Intros Particle Sensor
Minneapolis, MN — New from CyberOptics Corpo- ration (NASDAQ: CYBE) is its ReticleSense Air- borne Particle Sensor (APSR) which is an exten- sion of the wafer-shaped WaferSense Airborne Particle Sensor (APS) line that has been adopted by major semiconductor fabs and OEM equipment makers worldwide. To address the market demand for airborne
particle measurement in 150mm semiconductor and gallium arsenide (GaAs) fabs in China, Eu- rope, Japan, the U.S. and Taiwan, as well as LED fabs, the company has also extended its APS line to include a 150mm wafer form factor. With APS technology, equipment engineers can quickly and wirelessly monitor, identify and troubleshoot air- borne particles in real-time within semiconductor process equipment and automated material han- dling systems. WaferSense and ReticleSense Air- borne Particle Sensors enable equipment engi- neers to shorten equipment qualifica-
Space-Qualified CompactPCI
from Aitech Chatsworth, CA — Aitech Defense Systems Inc.'s SP0 3U CompactPCI SBC has passed final 100kRad (Si) ctesting for use in low (LEO) and medium (MEO) orbits and has dem - on strated high confidence for geosta- tionary orbits (GEO). The SP0 was tested at the world-
renowned Indiana University Cy- clotron Facility (IUCF) that provides proton radiation testing for space ex- ploration programs for NASAs' John- son Space Center. The SBC under- went intense radiation testing per- formed with 200MeV protons designed to test total ionizing dose (TID) and single event effects (SEE) for particles with linear energy transfer (LET) up to 15MeV. The measured TID of the SP0 under test easily met the target 100 kRad (Si) with no latch up or per-
tion, release to production and maintenance cycles all while reducing expenses. Customers have expe-
rienced up to 88 percent time savings, up to 95 per- cent reduction in costs, and up to 20X the through- put with half the manpower resource require- ments using the WaferSense APS relative to lega- cy surface scan wafer methods. The WaferSense measurement portfolio includ-
ing the Auto Leveling System (ALS), the Auto Gap- ping System (AGS), the Auto Vibration System (AVS), the Auto Teaching System (ATS) and the Air- borne Particle Sensor (APS) are available now in 150mm, 200mm, 300mm and 450mm wafer sizes. The ReticleSense Airborne Particle Sensor (APRS) and ReticleSense Auto Leveling System (ALSR)
products are available in a reticle shaped form factor. Contact: CyberOptics Corporation,
5900 Golden Hills Dr., Minneapolis, MN 55416 % 763-542-5000 fax: 763-542-5100
WaferSense airborne particle sensor.
E-mail:
info@cyberoptics.com Web:
www.cyberoptics.com
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Space-qualified computer board.
formance degradation. The compact 3U SBC provides exceptional on-board functionality combined with a low power consumption of only 10W. Using a MPC8548E PowerQUICC-III processor enables a processing speed of 1.17GHz as well as 333.3MHz of core complex bus (CCB) and fast DDR1 memory speeds. The SP0s' processor includes an
e500 System-on-Chip (SoC) integrat- ing both an L1 cache with 32kB in- struction and 32kB data and a 512kB L2 cache. A large user Flash of 1GB is standard, with the option to ex- pand up to 8GB. The large on-board memory also includes up to 512MB of fast DDR1 SDRAM with ECC protec- tion for high data integrity as well as 512KB of redundant Boot Flash to meet both processor and application
needs. Contact: Aitech Defense Sys- tems, Inc., 19756 Prairie Street,
Chatsworth, CA 91311 % 888-248-3248 fax: 818-407-1502 E-Mail:
sales@rugged.com Web:
www.rugged.com
See at NEPCON South China, Booth A-1G10
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