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electronic markets, from consumer to military electronic products. The
assembly process with aluminum boards can also make it more diffi- cult to extract and reuse components,
injecting them into the supply chain as counterfeit devices. The electrical, mechanical, and
thermal benefits of aluminum boards can boost electronic product reliabili- ty, in concert with avoiding the ther- mal effects from the high-tempera- ture lead-free soldering process. Also, eliminating the solder joints eliminates a major source of failures in electronic circuits. Aluminum boards can also remove concern for tin whiskers, which are conductive anodic filaments (CAFs) that form between adjacent viaholes in certain circuit-board materials.
The RoHS Mandate Elimination of lead from elec-
tronic solder by European Union (EU) RoHS mandate has been costly. However, reverse manufacturing processes, which eliminate solder, also make compliance with the RoHS man- date almost automatic. An aluminum circuit assembly has an all-copper and polymer interconnection system on an aluminum base. Both RoHS and REACH con-
cerns should be obviated. Additionally, the material declaration process is greatly simplified. These same bene- fits hold true relative to the use of con- flict materials which is of growing con- cern among increasing numbers of both governmental and non-govern- mental organizations (NGOs) as the structures completed as described are completely devoid of any proscribed or sanctioned materials and will more easily pass regulatory scrutiny. Environmental concern has
grown over the last few decades, mak- ing most electronics manufacturers aware of the need to produce “environ-
August, 2014 Benefit By Reversing Electronics Manufacturing
mentally friendly” products. This can be done with a board material that is easily recycled, such as aluminum. Also, by not using solder and the ener- gy required in soldering processes, energy is saved in the electronics manufacturing process through the use of aluminum boards. A recurring concern associated
with reverse manufacturing has been how to test and rework these new elec- tronic assemblies. Of course, if they are manufactured properly, there will be no need to test and rework the boards. Eliminating solder and solder joints can eliminate a leading source of failures in many circuit boards, espe- cially under conditions of shock and vibration. Moreover, below 0.5mm component lead pitch, which is where the component roadmap trends are headed, assembly yields drop off appreciably, even with multiple pre- assembly inspection steps implement- ed and/or applied. High yield should be a goal for
all electronics manufacturers. With aluminum boards and reverse manu- facturing approaches, if the compo- nents are properly burned-in and fully tested, and manufacturing processes are properly controlled, a final product should be achieved with high yield. In this way, the reliability limits of future electronic products will be established by IC and compo- nent reliability rather than by the reliability of the circuits and plated viaholes used to interconnect the ICs and components. Contact: Verdant Electronics,
500 Yale Ave. North, Seattle, WA 98109 % 206-351-8943 E-mail:
joe@verdantelectronics.com Web:
www.verdantelectronics.com r
Corelis Releases New V.8.0 Boundary-Scan Tool Suite
Cerritos, CA — Corelis, Inc. has released version 8.0 of its ScanExpress Boundary-Scan Tool Suite. This new version includes significant improve- ments to the ScanExpress Debugger JTAG analyzer and toolkit, a new inter- face for managing ScanExpress TPG projects, plus numerous new features spanning all ScanExpress applica- tions. Software improvements include: enhanced ScanExpress Debugger interface with an updated pin browser interface, two new script modules, a JTAG protocol scan module; new top- level ScanExpress TPG project with project revision and comparison wiz- ards, support for netlist and BOM replacement, was/is file support for back-annotation; ScanExpress JET can now record the boot sequence of a known-good system to automatically create a repeatable initialization script; new JET model management system makes CPU and peripheral updates easier to obtain; new CD menu provides easy access to installers, documentation, and addi- tional resources; support for Teradyne Di-Series modules and FTDI FT2232 ICs as JTAG controllers. Current Corelis customers with a
valid maintenance contract can now access the new version 8.0 CD through the Corelis support website. The compa- ny offers free training to all clients so that they may immediately utilize the various new product features and inno- vations now available. Class schedules and registration information can be found on the Corelis website. Contact: Corelis, 13100
Alondra Blvd., Cerritos, CA 90703 % 888-808-2380 or 562-926-6727 Web:
www.corelis.com
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