August, 2014
www.us-
tech.com
Implementing Warpage Management: A Five-Step Process Continued from page 53
can be added to different locations within an EMS facility. For example, they can usually fit within existing incoming quality control (QC) or outgoing quality assurance (QA) departments. They also make sense within a manufacturing engineering department. A new warpage measurement system and personnel training for it usually requires about two or three days. Maintenance and upkeep are sim- ple, usually only requiring only about one-half day of preventative maintenance each year. Once warpage measurement equipment is in
place, and an EMS organization has a plan for using and sharing data that is collected, it is a good idea to test, analyze, and report results according to industry “best practices,” so that col- lected data will correlate with warpage manage- ment data from other companies, including origi- nal equipment manufacturers (OEMs), partner companies, and even competitors.
Data Correlation Data correlation is critical,
especially for OEMs partnered with a large network of suppliers and EMS providers. For example, Akrometrix assists OEMs and EMS companies in correlating their data, especially in cases where the validity of collected data may be in doubt. Testing at Akrometrix is performed according to “best practices” that are published and available to all TherMoiré users. These guides offer “how to” explana- tions of setting up and performing measurements, with clear instruc-
Modular AOI System Starts at the Bottom
Continued from previous page
The X-Y drive gantry delivers 1500 cps/min inspection capability with precision and accuracy. The system includes an automatic microscope function to verify defects on the repair station, without need of operator intervention. Each modular SpectorBOX sys-
tem features a general-purpose input/ output (I/O) configuration to simplify
Power electronic
tions on operating the equipment that will lead to accurate results that can be correlated with results achieved by any other TherMoiré user who is also producing accurate results. The last step in a warpage management pro-
gram is more of a continuous process than a step. With a well-running warpage management system in place, EMS providers can be prepared for any warpage-related customer request as well as any reflow assembly process problems involving shape mismatches within the process temperature profile (defects such as head-on-pillow, non-wet opens, or shorts). Tools such as the Akrometrix Interface Analysis system enable simple but powerful visual- ization and evaluation of interconnect gaps between top and bottom assembly surfaces at any tempera- ture during the process. This system can help deter- mine problem locations where defects are likely to form. Understanding how components fit within interfaces at each stage of reflow assembly can help in the adjustment of process parameters, such as solder print sizes for critical locations, and provide
CondensoX Series Vapour Phase Soldering
Page 55
better yields and higher product reliability. Ongoing data collection and analysis makes it
possible to perform statistical process control (SPC) of the warpage characteristics of all compo- nents involved in reflow assembly. Knowing when data is indicating a statistically “out of control” sit- uation can provide a warning that assembly process parameters may need to be adjusted to ensure consistent output quality. As components become thinner, with more
interconnections that must be properly soldered, warpage management increases in importance. Companies with warpage management systems in place benefit from improvements in end-product yield and reliability, and EMS providers without warpage management programs are more and more considering the value of implementing such a system in their own facilities. Contact: Akrometrix LLC, 2700 Northeast
Expressway, Building B, Suite 500, Atlanta, GA 30345 % 404-486-0880 fax: 404-486-0890 Web:
www.akrometrix.com r
Electronics Manufacturing
Package on Package Semiconductor
Hardening of adhesives and compounds Voidfree Soldering
leadfree soldering up to 240° Photovoltaics MIIDs Substrates on heat sinks Visit us at
NEPCON Shenzhen – Hall 1 A-1H10 –
The modular design of the SpectorBOX AOI system allows
positioning at almost any check point along a conveyer belt.
the interface with new or existing con- veyer systems. It is currently avail- able in sizes to 550 x 520mm (21.7 x 20.5-in.). Contact: MEK (Marantz
Electron ics Ltd.), MEK Americas, 5550 Painted Mirage Road, Suite 320, Las Vegas, NV 89149 % 702-818-1706 E-mail :
info@marantz-electronics.com Web:
http://mek-europe.com/AOI- bottom-up.php or Christopher Associates, 3617 W. MacArthur Blvd., Santa Ana, CA 92704 % 714-979-7500 Web:
www.christopher.com r
Co den o App icat
CondensoX Series Vapour Phase Soldering with vacuum
Condenso Applications Source: Osram See at NEPCON South China, Booth A-1H10 Source: Audi
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