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Page 60


www.us- tech.com


From Pluggable to High Power Terminal Blocks


ZST Pluggable Tension Spring Connection System


Continued from page 58 l


l Packaging Equipment


PCB Assembly: l


l l l


HSKG High Power Stud Terminals


...and Everything In Between


Conta-Clip, Inc. offers a comprehensive line of high quality terminal blocks for applications ranging from cable harnesses to energy transmitting applications


Available Wire Connection Types: • Screw Connection System • Pressure Spring Connection System • Tension Spring Connection System • Stud Connection System • Spade Connection System


Wire Range: • 0.5 mm2


to 300 mm2


For more ZST and HSKG product line information


Ratings: • 300V up to 1000V • 15A up to 520A


Approvals: • UL


• CSA • IEC


• CE • GOST


• NEMKO • GL • KEMA


Call 732-564-0705, e-mail: info@contaclipinc.com, or visit contaclipinc.com


usa.contaclipinc.com/ustech l l l l l l l


Solder Paste Inspection Equipment (optical or x-ray) l Pick-and-Place Equipment


Solder Paste Application Equipment (stencil printer)


Baking Ovens


Reflow System (convection ovens, vapor phase, others)


Component Placement Inspection (optical)


Specialty Cleaning Equipment


Inspection and Test Equipment (optical x-ray and electrical)


l Depanelization Equipment l Packaging Equipment


Solder Rework and Repair Equipment


Capital Equipment List for SAFE Assembly (Abbreviated list)


l Pick-and-Place Equipment l


Component Placement Inspection (optical)


l


l Encapsulation Equipment l


Shearing and Punching Equipment


Via Formation Technology (Laser or photoimage)


Surface Preparation Equipment (chemical and mechanical)


l Image Development Equipment l Routing / Depanelizing Equipment l Cleaning Equipment


Coating Equipment (for photoimage materials)


l


Metallization and Plating Equipment


At any given lead pitch, solderless assembly methods can significantly


reduce circuit layer count by freeing up routing space as well as assembly height, since solder often comprises one-half of the overall height of a board-mounted package or device.


tial reduction in total layer count (further reducing cost). Judicious component selection and use of a common grid pitch (e.g., 0.5mm) has been shown to reduce layer count while improving signal integrity. The aluminum core can also


Packaging Equipment Although these lists are not


Electronic & Engineering Materials


exhaustive (many minor process steps are not represented in both equipment lists), they provide a rea- sonable approximation of the differ- ences in capital equipment require- ments of traditional versus SAFE assembly approaches.


Numerous Benefits Reverse manufacturing of elec-


Ask about our IPC-CC-830 / MILil-46058C conformal coatings designed for easy dip or spray application on printed circuit boards and surface mount devices.


tronic circuits can provide a number of advantages compared to tradition- al PCB manufacturing, especially for circuit assemblies made with alu- minum. These include economic ben- efits, electrical benefits, thermal ben- efits, and mechanical and reliability improvements. For example, manu- facturing cost is a constant concern. The use of aluminum, the third-most abundant material on Earth, which is sold by weight regardless of thick- ness, can help control electronic manufacturing costs. Aluminum is less expensive per unit volume than FR-4 circuit material. In contrast, the price of polymer materials varies with the price of oil. Using aluminum cuts manufac-


Learn more about our Conformal Coating Products


® Member 314.621.5700 www.elantas.com/pdg


turing costs by reducing the number of manufacturing steps required, eliminating conventional processing steps associated with solder. The final cost of aluminum-based circuit assemblies can be 25 to 35 percent less than circuit assemblies produced by conventional means (exclusive of component costs). In addition, with aluminum, electronic components need not be prepared with special finishes to maintain solderability, and they do not require special treat- ment to keep out moisture since they


serve as a power, ground, or integral shield. Moreover, the completed assembly can also be relatively easi- ly provided with metal plating after the assembly is complete. This makes the entire assembly metal jacketed and immune to electromag- netic interference (EMI) and electro- static-discharge (ESD) effects, and nearly hermetic, exclusive of areas left open for external input/output (I/O) connection. At any given lead pitch, solder-


less assembly methods can signifi- cantly reduce circuit layer count by freeing up routing space as well as assembly height, since solder often comprises one-half of the overall height of a board-mounted package or device. When used as a carrier, alu-


minum is by default a heat spreader as an integral part of the assembly,


When used as a carrier,


aluminum is by default a heat spreader as well an


integral part of the assem- bly, supporting thermal design and long-term reliability.


supporting thermal design and long- term reliability. Integration within the aluminum assembly also protects the encapsulated components from the effects of shock and vibration. Since the CTE values of aluminum and copper are close (22ppm/°C vs. 18ppm/°C), thermal stress is low on aluminum-board interconnections. Thin aluminum base material can be used for forming a product into a desired shape. The use of aluminum boards


provides some measure of design security, making the reverse engi- neering of a product more difficult. The benefit extends to a range of


Continued on page 66


August, 2014 Reversing Electronics Mfg.


Testing Equipment (electrical and X-ray)


will not be subjected to the high tem- peratures required to process lead- free solders. Reverse manufactured assem-


blies offer several electrical/electron- ic benefits. For example, where con- nections are made to terminations on component lands, the point of inter- connection can be made without ben- efit of a large pad, which can reduce parasitic capacitance. This also frees routing space, allowing for a poten-


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