August, 2014
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Page 63 Koh Young Unveils New 3D Measurement System
San Francisco, CA — Sharp-eyed like a falcon, Koh Young’s new HORUS inspection system is named after the ancient Egyptian falcon god, and provides unexpected capabilities and special powers. While the system excels at semiconductor applications, it is especially suitable for the full range of electron- ics manufacturing and assembly applications including board-level SMT. For example, HORUS can measure the vol-
ume and dimension of virtually any type of sub- stance, part, component, die, including very small features, very quickly and with astonishing accu- racy. It can also precisely measure transparent and shiny materials with high speed and accuracy, something that no other inspection systems cur- rently available can do. HORUS will help customers realize higher
yields in Semicon ductor and Advanced Packaging applications by measuring objects that have been considered difficult to measure with appreciable speed — without sacrificing accuracy. The system’s primary advan-
T
tage over current systems is that HORUS can measure virtually any
Kyzen Intros Nano-Coat Friendly Stencil Cleaner
Nashville, TN — Kyzen is showcas- ing its new AQUANOX® A8820, which effectively removes common solder pastes and fluxes, and demon- strates a favorable compatibility pro- file with stencil cleaning systems. It works well with spray-in-air and select ultrasonic cleaning machines, and is also effective on uncured adhe- sives. Additionally, the no-foaming property of A8820 is compatible with all materials commonly used in elec- tronic assembly manufacturing and cleaning processes. This stencil cleaning product
was designed from the ground up to meet the tough challenges of clean- ing no-clean, lead-free residue from small, 01005 apertures while being compatible with today’s nano-coat- ings as well as with all the offline
HORUS measurement on a TSV (through silicon via) package.
object, and is particularly capable of precisely measuring transparent ones at production speeds. It is the first machine with this capability to enter the market. It can measure shiny objects including flux
and solder balls using its very wide Field of View (FOV) optics. The combination of wide FOV and quick inspection speed allows HORUS to be used as an in-line inspection machine. This will also facilitate lot testing on all products, rather than traditional sampling inspection made necessary by
slow inspection speeds. Contact: Koh Young America Inc., 6150 W.
Chandler Blvd., Suite #39, Chandler, AZ 85226 % 480-403-5000 fax: 480-403-5001
E-mail:
america@kohyoung.com Web:
www.kohyoung.com
See at NEPCON South China Booth #A1-P45.
Koh Young Technology, the global leader in patented true 3D AOI and SPI inspection systems, continues to develop best-in-class technology solutions to meet the emerging challenges of PCB design and assembly:
Koh Young’s Zenith 3D AOI inspection eliminates false calls, escapes, shadowing, specular problems, and helps you optimize your process;
aSPIre 2 from Koh Young America delivers 100% 3D Inspection of
solder paste with unmatched speed and accuracy, for zero defect manufacturing goals;
Cleaner gets all of the smallest apertures on stencils.
cleaning equipment currently used in the industry. Providing increased perform-
ance adds real value with better prints and cutting edge, green tech- nology that is better for the environ- ment. In addition to excellent rins- ing, this cleaner saves money and provides excellent cost of ownership. The cleaner is available in 3.8,
18.9, and 208.2 liter containers. Contact: Kyzen, 430 Harding
Industrial Dr., Nashville, TN 37211 % 800-845-5524 or 615-831-0888
fax: 615-831-0889 E-mail:
info@kyzen.com Web:
www.kyzen.com
See at NEPCON South China Booth #A-1P35.
Visit
www.Kohyoung.com Today to Learn More
See at NEPCON South China, Booth A-1P45
The new KY8030-3 3D SPI system features a new hardware platform for greater robustness and reliability, plus the latest KY software platform, more powerful and with greater functionality, a true color display, and foreign material inspection.
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