March, 2012
www.us-tech.com
Eindhoven, The Netherlands — Assem bléon is debuting iFlex after its successful first showings in Europe. iFlex is a new, innovative, intelligent and flexible SMT solution for electron- ics manufacturers. It is especially designed to increase productivity in
Assembléon Intros Hi Speed Pick-and-Place Platform
ly on a single manufacturing line. The flexibility built into iFlex allows manufacturers to assemble high- quality PCBs of any quantity, no matter how much variety. This makes the system especially suitable for the high product mix environ- ments increasingly being demanded in the industry. With three modules, iFlex can be
configured to tailor assembly lines — from 1 to more than 8 modules — for any production need. The T4 system suits chip and small IC shooting (4
placement robots, placement speed of 51,000 cph, 128 twin tape feeder posi- tions). The T2 is aimed at flexible placements (2 placement robots, place- ment speeds of 24,000 cph, 128 twin tape feeder positions). The iFlex H1 is for ICs and fine pitch placements (1 placement robot, placement speed of 7,100 cph, max 146 twin tape feeder positions/max 30 tray positions). The iFlex is a complete pick-
and-place solution and supported by Mentor Graphics’ Valor software suites (both NPI and MES). These
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help plan, prepare and test the PCB assembly before production starts and will control the actual assembly process from beginning to end,
including detailed traceability data. Contact: Assembléon America, Inc., 5110 McGinnis Ferry Rd.,
Alpharetta, GA 30005 % 800-474-4547 or 770-751-4433 fax: 770-751-4450 E-mail:
terry.york@assembleon.com Web:
www.assembleon.com
See at IPC/APEX Booth #1407. Fast pick-and-place platform.
high product mix environments by more than 30 percent. iFlex produces the highest board quality since it uses the company’s unusual single- pick/single-place tech nology, which provides an extraordinarily high First Pass Yield production level with defect levels of less than 10 DPM. The modular iFlex is reportedly
easy to install, and is supported by smart software tools also easy to pro- gram without hardware reconfigura- tion. With its dual transport lanes, dual-sided feeding, internal buffer positions and feeder and trolley exchanges during production, iFlex has been designed for highest throughput. The company’s “Inde - pendent Dual Lane” concept allows manufacturers to produce in volume on one lane, while frequently and independently changing jobs on the second. That allows a great variety of PCBs to be assembled simultaneous-
Best-Kept Cleaning Secret
New Horizons in Bond Testing
The Nordson DAGE 4000Plus is the most advanced bondtester on the market, representing the industry standard in bond testing.
Data Integrity
Revealed by Kyzen
Nashville, TN — Kyzen is highlighting the company’s Process Control System (PCS) Type II —one of the devices that has become an essential tool for cus- tomers. This invaluable tool will moni- tor the wash bath of any inline cleaning system and maintain the concentra- tion. The Type II is designed to control splitting cleaning materials. Scores of these systems are installed around the world, saving Kyzen customers time and money as well as ensuring quality cleaning results. Kyzen is best known for its
cleaning materials. The tremendous popularity of its AQUANOX® A4625 Aqueous in-line cleaning solution, highlighting the control technology to fully automate wash tank mainte- nance, is indicative of the complete
cleaning capabilities of its offerings. Contact: Kyzen Corporation, 430
Harding Industrial Drive, Nashville, TN 37211 % 615-831-0888 E-mail:
info@kyzen.com Web:
www.kyzen.com
See at IPC/APEX Booth #3242. See us at APEX, Booth 3028
Developed by the world leader in bond testing technology, the 4000Plus offers unsurpassed accuracy and repeatability of data providing complete confidence in results.
Hot Bump/Pin Pull on the 4000Plus
A unique patent protected technique for attaching a probe to solder bumps or paste and performing a pull test in accordance with the IPC standard IPC9708 pad cratering testing for surface mount and printed board assemblies.
software for easy on screen profiling and control. A selection of standard probe sizes are available with custom tips available on request.
Learn more at
www.nordsondage.com/4000Plus
www.nordsondage.com |
usglobalsales@nordsondage.com
The 4000Plus HBP application is achieved by simply selecting a specialized load cartridge which can be programmed to apply a temperature-time reflow profile to individual bumps/bonds using a probe. Pre-heating, soak, rate of rise, liquidus and cooling are all integrated into the 4000Plus Paragon™
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