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www.us-tech.com
March, 2012 Viscom: 3-D SPI AOI System with Uplink
Atlanta, GA — Viscom is showing its recently introduced 3-D SPI system now available with the special SPI- AOI Uplink feature that provides better defect detection during post- reflow AOI, ensuring the lowest false alarm rates. The new S3088 SPI 3-D solder
paste inspection system is based on the field-proven S3088 platform, combining efficiency and user-friend- liness.
The new product uses highly
accurate measurement data avail- able of the paste print to optimize post-reflow automatic optical inspec- tion (AOI) at the end of the produc- tion line. SPI measurement data are
typically only used to classify paste print, allowing high tolerances of up to ±50 percent volume. Viscom’s new SPI-AOI Uplink feature enables the use of information later in the process to assure post-reflow defect detection while allowing high vari- ability of the paste print process. The evaluation of process
errors, such as marginal print results that are just below the defect threshold, provides valuable infor- mation about the expected solder joint quality. For every solder joint that is subject to post-reflow inspec- tion, the volume, shape and position data of the corresponding solder paste deposit is made known to the
AOI via the Uplink interface. This allows users to automatically adapt the post-reflow AOI inspection parameters according to the expected defect type. Too little paste volume often
leads to open solder joints while sol- der bridges could be the product of excessive paste deposits. The tighter classification of the AOI consequent- ly results in better defect detection while reducing false alarms. In addition, the depiction of
paste images and additional data, together with AOI solder joint images at the post-reflow verification station, enhances the manual classi- fication process.
Contact: Viscom USA, 1775 AOI SPI system.
Breckinridge Parkway, Suite 500, Duluth, GA 30096 % 678-966-9835 E-mail:
info@ViscomUSA.com Web:
www.ViscomUSA.com
See at IPC/APEX Booth #3629.
Transition Automation Introduces Ultra-Fine Pitch Printer
Tyngsboro, MA — Transition Auto - mation, Inc. has released is newest innovation: the PrinTEK I series of Ultra-Fine Pitch SMT printers. This new system benefits from the compa- ny’s long experience and expertise in Fine Pitch SMT printing and squeegee design. The result is report- edly exceptional ease of use and qual- ity, at a low cost entry point in a bench-top format.
Entry level precision tabletop screen printer.
The PrinTEK I achieves this
result with several key innovations: a synchronized 4-cam liftoff system, a magnetic array table with locking pin-plates to easily tool up the PC board position, and rugged and accu- rate 3-dimensional adjustment via precision x, y, and theta anti-back- lash adjustment heads. The system can accommodate
PC board sizes up to 18 x 18-in. (457 x 457mm). The family of printers includes larger sizes which can accommodate 18 x 24-in. (457 x 609mm), and 24 x 36-in. (609 x 914mm) size PC boards. As an added benefit, users can
purchase a Patented Dual Squeegee Gantry head as an option as well as a Dual Video Microscope Alignment system. Both of these options are field upgradeable by the user allow- ing for a low cost entry and scalabili- ty as the user’s production demands increase.
Contact: Transition Automation, 5 Trader Circle, Building D,
Tyngsboro, MA 01879 % 800-648-3338 or 978-649-2400 fax: 978-649-2402 Web:
www.transitionautomation.com
See us at APEX, Booth 2535 See at IPC/APEX Booth #2703.
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