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hi-TeCh evenTS
www.us-tech.com APEX: New Products Star, Printed Wiring the Rise
Bannockburn, IL — IPC APEX EXPO (February 28-March 1, 2012, San Diego Convention Center) will present advances in more than 100 product categories within the electronics man- ufacturing supply chain. More than 250 new products and services will debut at the EXPO, with new products introduced by over a quarter of the more than 400 exhibitors — a fitting testament to the event’s theme, Information that Inspires Innovation. Filling two levels of exhibit
halls, companies serving the elec- tronics assembly, test and printed board industries will present the lat- est technologies, materials and pro - cesses to help attendees gain efficien- cies, enhance their processes and get up-to-date on new industry research and developments.
New Product Zone A new addition to this year’s
show floor is the New Product Zone, which gives exhibitors an opportunity to highlight leading-edge equipment, materials and services that are break- ing new ground for the industry.
Hanover, Germany — On April 22, 2012, the Premier of the People’s Republic of China, Wen Jiabao, will open HANNOVER MESSE together with the Chancellor of the Federal Republic of Germany, Dr. Angela Merkel.
Described as the world’s most
important showcase for industrial technology, Hanover Fair will be held April 23-27 at the Hanover Fairgrounds, Hanover, Germany. China is the featured Partner
Equipment and materials for
electronics assembly, manufacturing and test; chemicals, materials and equipment for PCB manufacturing; design software; and printed electron- ics are all categories that will be rep- resented on the show floor.
Printed Electronics A key enabling technology that
is making a significant impact on consumer, commercial, medical and specialty electronics markets, print- ed electronics is coming of age. This year’s APEX EXPO will
feature a dedicated printed electron- ics area on the show floor, a printed electronics track in the technical con- ferences, and historic standards development meetings where the first-ever industry requirements for the manufacture and assembly of printed electronics will be discussed and developed. Although the printing of active
devices, such as thin film transistors (TFTs) for display backplanes and RFID, has been moving along, some of the technology is already 25 years old.
China Premier Opens Hanover Fair
Country at this year’s Hanover Fair. The People’s Republic will take this opportunity to present its extensive modernization program and efforts toward smart sustainability solu- tions. China will showcase its capa- bilities in this area under the head-
ing “Green + Intelligence”. Contact: Hannover Fairs USA,
Inc., 212 Carnegie Center, Princeton, NJ 08540. % 609-987-1202. E-mail:
hannoverfair@hfusa.com Web:
www.hfusa.com
2012 MONTH February March April EDITORIAL
Components & Distribution Electronics West/MDM (PP)
Assembly & Packaging APEX PP
Test & Measurements Assembly New England PP
May/June Components & Distribution EDS PP
AATE/MDM PP
EDITORIAl CAlENDAR SHOW
DATE
DesignCon APEC
Elect. West/MDM APEX
WESTEC Design-2-Part
Assembly New England Design -2-Part Del Mar Electronics
SMT/HYBRID/PKG EDS Mfg4
Wire Processing Tech Atlantic Design/MDM AATE
July August
Assembly & Production Semicon West/Intersolar PP
Test & Measurements Autotestcon PP
September SMT & Production SMTAI PP
October
Components & Distribution electronica PP
November Test & Measurements Electronics West/MDM PP
PP= Product Preview
1/31 - 2/1 2/7 - 2/9 2/14 - 2/16
2/28 - 3/1 3/27 - 3/29 3/28 - 3/29
4/25 - 4/26 5/1 - 5/2 5/2 - 5/3
5/8 - 5/10 5/8 - 5/10 5/8 - 5/10 5/8 - 5/10 5/22 - 5/24 6/19 - 6/21
SEMICON West/Intersolar 7/10 - 7/12 IMAPS
Autotestcon Design-2-Part
IPC Midwest PCB West SMTAI
MDM MINN. Design-2-Part electronica
Electronics West/MDM
9/11 - 9/13 9/11 - 9/13 9/19 - 9/20
TBD
9/25 - 9/27 10/16 - 10/17
10/31 - 11/1 10/31 - 11/1 11/13 - 11/16
LOCATION
Santa Clara, CA Orlando, FL Anaheim, CA
San Diego, CA Los Angeles, CA Atlanta, GA
Boston, MA Schaumburg, IL San Diego, CA
Nuremberg, Germany Las Vegas, NV Hartford, CT Milwaukee, WI Philadelphia, PA Chicago, IL
San Francisco, CA
San Diego, CA Anaheim, CA Akron, OH
Schaumburg, IL Santa Clara, CA Orlando, FL
Minneapolis, MN Marlborough, MA Munich, Germany
2/12 - 2/14, 2013 Anaheim, CA
Dan Gamota, president of Printovate Technologies, Inc., sees 2012 as a “turning point” for the industry.
Product Design Freedom “Printed electronics is a lower-
cost technology that provides greater product design freedom,” explains Gamota. “Innovative companies that recognize that fact are integrating printed electronics technologies in a variety of automotive, aerospace, communications, medical, and smart grid applications, to get a jump on their competition. “As the premier event for the
electronics manufacturing indus- tries, IPC APEX EXPO presents an ideal venue to showcase the applica- tions and benefits of printed elec- tronics,” says Gamota. “The stan- dards development meetings allow engineers from companies in all areas of printed electronics to con- tribute to the development of the very first industry guidelines. It?s a truly exciting time for companies in this growing field.” Last year, IPC established a
Printed Electronics Committee (D60) and five subcommittees (D61, D62, D63, D64 and 8-61) to develop stan- dards to facilitate companies to seam- lessly integrate printed electronics technologies in future products. These volunteer committees will meet at IPC APEX EXPO on March 1-2 to work on guidelines in printed elec- tronics design, base materials/sub- strates, base materials, functional materials and final assembly as well as the development of a printed elec- tronics technology roadmap. On February 29, the technical
conference sessions on printed elec- tronics (S36-S38) include papers highlighting advanced materials, emerging technologies and manufac- turing processes — from ink to flexi- ble substrates to roll-to-roll manufac- turing. In S36 Printed Electronics, Gamota will discuss the printed elec- tronics standards development ini- tiatives underway in the areas of base materials, additive materials,
design and final assembly. Contact: IPC % 877-472-4724 or 847-597-2860 Web:
www.ipc.org
Trade Show Calendar MORE SHOWS:
www.topline.tv/tradeshows.cfm
Feb. 28-Mar.1, 2012, APEX. *San Diego Convention Center, San Diego, CA. Contact: IPC % 877-472-4724 or 847-597-2860 Web:
www.ipc.org
Mar. 1-2, iNEMI Roadmap Workshops.*San Diego Convention Center, San Diego, CA. Contact:
www.inemi.org
Mar. 6-10, CeBIT Hannover.*Hannover Fairgrounds, Hannover, Germany. Contact: Hannover Fairs USA, Inc., 212 Carnegie Center, Princeton, NJ 08540. % 609-987-1202. E-mail:
hannoverfair@hfusa.com Web:
www.hfusa.com
Mar. 20-22, FABTECH Canada. *Toronto Congress Centre, Toronto, Ont. Canada. Contact: SME, One SME Drive, Dearborn, MI 48121 % 800-733-4763 or 313-271-1500 fax: 313-271-2861 Web:
www.fabtechcanada.com
Mar. 21-22, Solar Mfg. & Reliability Conference.*San Jose, CA. Contact: SEMA, 3617 W. MacArthur Blvd., Santa Ana, CA 92704 % 714-979-7500 Web:
www.smta.org/solar
Mar. 21-22, Design-2-Part Show. *Santa Clara Convention Center, Santa Clara, CA. Contact: Design-2-Part Shows, P.O. Box 7193, Prospect, CT 06712 % 203-758-6663 Web:
www.d2p.com
Mar. 27-29, WESTEC. *Los Angeles Convention Center, Los Angeles, CA. Contact: SME, One SME Drive, Dearborn, MI 48121 % 800-733-4763 or 313-271-1500 fax: 313-271-2861 Web:
www.westeconline.com
Mar. 28-29, Design-2-Part Show. *Cobb Galleria Center, Atlanta, GA. Contact: Design- 2-Part Shows, P.O. Box 7193, Prospect, CT 06712 % 203-758-6663 Web:
www.d2p.com
Apr. 11-12, Design-2-Part Show. *Meadowlands Exposition Center, Secaucus, NJ. Contact: Design-2-Part Shows, P.O. Box 7193, Prospect, CT 06712 % 203-758-6663 Web:
www.d2p.com
Apr. 23-27, Hannover Fair 2012 *Hannover Fairgrounds, Hannover, Germany. Contact: Hannover Fairs USA, Inc., 212 Carnegie Center, Princeton, NJ 08540. % 609-987-1202. E-mail:
hannoverfair@hfusa.com Web:
www.hfusa.com
Apr.25-26, Assembly New England/Electronics New England.*Boston Convention & Exhibition Center, Boston, MA. Contact: UBM Canon, 11444 W. Olympic Blvd., Los Angeles, CA 90064-1549 % 310-445-4200 fax: 310-996-9499 Web:
www.ubmcanon.com
May 8-10, 2012, SMT/HYBRID/PACKAGING. *Nuremberg Trade Fair Center, Nuremberg, Germany. Contact: Kallman Associates, Inc., 20 Harrison Avenue, Waldwick, NJ 07463-1709 % 201-652-7070 fax: 201-652-3898 E-mail
jerry@kallmanexpo.com Web:
www.mesago.de/en/SMT
May 9-10, 2012, Wire Processing Technology Expo *Frontier Airlines Center, Milwaukee, WI. Contact: 800-367- 5520, web:
www.electricalwireshow.com
Aug. 19-23, 2012, IPC Midwest. *Schaumburg Renaissance, Schaumburg, IL. Contact: IPC % 877-472-4724 or 847-597-2860 Web:
www.ipc.org
Sep. 10-15, Industrial Automation North America. *McCormick Place, Chicago, IL. Contact: Hannover Fairs USA, Inc., 212 Carnegie Center, Princeton, NJ 08540. % 312-924-1688. E-mail:
hannoverfair@hfusa.com Web:
www.hfusa.com
March, 2012
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