March, 2012
Manual Handling of Delicate Parts
Continued from page 57
ety of specialized pickup tips for dif- ferent applications. For example, when handling flat substrates such as wafers, solar cells or flat panels,
Tiny parts are handled by continuous vacuum supplied through a hose.
the tips themselves are flat. These tips require a constant vacuum source to overcome leakage between the substrate being handled and the pick-up tip itself. Substrates handled with this type of device typically range in size from 2 to 12-in. (51 to 305mm).
When handling parts smaller
than an 1/8-in. (3mm) a small-part tip is recommended. The business end of the small-part tip typically
has conical point ending in a flat area with a hole drilled down the center. The holes vary in size from 0.060 to 0.003-in. (1.5 to 0.076mm). The tip with the smallest hole size easily handles 100µm size parts. This style of tip is used with any of the abovemen- tioned systems that pro- vide a constant vacuum source such as the bench top tools that plug into an electrical outlet. In this case the vacuum pen has an air hose connected to the back of the tool and the pick-up tip is on the front of the tool. To handle parts with this system, simply touch the tip to the part and it is gripped for pick and place. To release the part, just tap the con- trol button on the side of the pen. Applications for this style of tip include handling items such as SMD components, small ball lenses, miniature springs, small optical
fibers, and other equally tiny and fragile parts.
Battery Power Battery-powered tools are used
where freedom of movement is a con- sideration. For example, in a clean- room operation, a battery-powered wafer wand has several advantages. First of all there are no hoses to get in the way. Vacuum hoses in a clean-
Continued on page 63
www.us-tech.com
Page 61
Really Managing PWB Supply Continued from page 59
assistance is not adequate. The sup- plier performance data collected at the program’s inception indicates that there is significant risk if C of Cs and supplier quality credentials (ISO, etc.) are the only evaluation prior to assembling parts on the PWB. Therefore, a successful pro- gram must have as its objective not only that PWBs are available when needed, it must ensure that only good PWBs are being assembled. To achieve that goal the following ele- ments are essential:
l Total management commitment to the program by the CM or OEM.
l Experienced PWB engineers at the PWBSCM.
l Front end software for PWB fabrication capable of doing Design Rule analysis.
l PWB CAM software for Arrays and file modifications.
l PWB inspectors trained in the IPC acceptance standard.
l Analytical laboratory capable of analyzing all major PWB charac- teristics (copper thickness, surface finish, interior construction, solder float, Ion Chromatography, X-ray fluorescence, isolation resistance, non-contact coordinate measure- ment (CMM).
l Bare board testing (Flying Probe). l Board Modification capability (routing, marking).
l Re-packaging equipment for vacuum sealing.
l Extensive ERP system to manage inventory and customer MRP linkage.
l Supplier Management Program by
Checking PCB under high-powered microscope.
A successful PWBSCM program
is not about a gate keeper that sorts out the bad product. It is about devel- oping a supply chain that delivers quality product consistently. The gate keeper then becomes a facilita- tor and enabler allowing the CM or OEM to better utilize their capital resources without fear of damaging their business. Contact: DIVSYS International,
LLC, 8110 Zionsville Road, Indianapolis, IN 46268 % 317-405-9427 fax: 317-663-0729 E-mail:
sales@divsys.com Web:
www.divsys.com r
See at IPC/APEX Booth #520.
PWBSCM that includes, but does not rely solely on annual audits. The system must collect supplier laboratory performance data about each shipment in addition to nor- mal procurement metrics.
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