Page 88
hi-TeCh evenTS
www.us-
tech.com MD&M West Outlines Largest Program to Date
Santa Monica, CA — Medical Design & Manufacturing (MD&M) West 2018 has announced its largest and most comprehensive program to date. MD&M West is scheduled to take place from February 6-8, 2018, at the Anaheim Convention Center in Anaheim, California. The conference is organized into
four tracks, along with additional smart manufacturing and 3D print- ing programs. The four main tracks are titled “Technical Problems,” “New Technology and Next-Gen Design,” “Product Development,” and “Regulatory and Quality.” These four categories run the
gamut from challenges with testing, coatings, polymers, and validation, to developing new technologies that
include batteries, flexible electronics, augmented/virtual reality, and bio- compatible circuitry. They also include information on the process of new product introduction, combination products, clinical trials, feasibility tri- als, as well as keeping up with shifting market regulations. Discussions will be held on licensing products in Canada and Latin America, along with new emerging regulations. Two new summits will highlight
smart manufacturing and 3D print- ing. The smart manufacturing summit is an extensive program with expert- led sessions focused on collaborative robots (cobots), artificial intelligence (AI), machine learning, big data, sens- ing technologies, and the Industrial IoT (Internet of Things).
DesignCon: Where the Chip Meets the Board
Santa Monica, CA — DesignCon® offers an in-depth, three-day confer- ence program curated by a panel of more than 90 industry professionals. The conference is scheduled to be held January 30 – February 1, 2018, at the Santa Clara Convention Center in Santa Clara, California. The conference will include more
than 100 technical paper sessions, panels and tutorials that span 14 dif- ferent tracks. DesignCon’s education- al content covers all aspects of elec- tronic design, including signal and power integrity, system co-design, and test and measurement methodologies. The conference’s 14 tracks cover
a range of technical design topics. The “Signal and Power Integrity at the Single/Multi Die, Interposer and Packaging Level” track covers such issues as system-on-chip (SoC) chal-
lenges, multi-chip integration and power delivery networks, and related noise and jitter mitigation strategies. The “Mixed-Signal Modeling:
Algorithmic and Simulation Solu - tions” track addresses challenges and solutions for design and verification that may involve various analog and algorithmic modeling abstractions and simulation approaches to predict system performance and reliability. The “Advances in Materials and
Processing for PCBs, Modules and Packages” track will consider how PCB materials and fabrication process can affect the electrical prop- erties and performance of the circuit-
ry mounted on the board. Contact: UBM, 2901 28th
Street, Suite 100, Santa Monica, CA 90405 % 310-445-4200 Web:
www.designcon.com r
2018 EDITOrIAL AND ISSUE Jan/Feb March EDITORIAL
Test & Measurement Electronics West/MDM PP
Assembly & Production APEX PP
April/May SMT & Assembly Nepcon China PP
Wire Processing Tech PP EDS PP
June July August
Test & Automation SMT/Hybrid/PKG PP ATX East /MDM PP
Production & Packaging Semicon West/Intersolar PP
PCB & Assembly Nepcon South China PP
September Test & Automation SMTAI PP
October Nov/Dec
Components & Distribution electronica PP
PP= Product Preview
Test & Measurement E
TrADESHOW CALENDAr SHOW
DATE DesignCon ATX/ Electronics West/MDM
APEX APEC
Advanced Design & Mfg Expo
BIOMEDevice Boston/ESC Nepcon China
Wire Processing Tech EDS
SMT/Hybrid/PKG ATX East /MDM
SEMICON West/Intersolar
Nepcon South China PCB West Autotestcon
IMAPS SMTAI
The Assembly Show MDM Minneapolis
FABTECH electronica ATX Montreal
BIOMEDevice, ESC
Jan. 30-Feb. 1 Feb. 6-8
Feb. 27-March 1 March 6-8 March 7-8
April 18-19 April 24-26 May 9-10 May 15-18
June 5-7 June 12-14
July 10-12
Aug. 28-30 Sept. 11-13 Sept. 18-20
Oct. 9-11 Oct. 17-18 Oct. 23-25 Oct. 31-Nov. 1
Nov. 6-8 Nov. 13-16 Nov. 14-15
Dec. 5-6 F
LOCATION
Santa Clara, CA Anaheim, CA
San Diego, CA San Antonio, TX Cleveland, OH Boston, MA
Shanghai, China Milwaukee, WI Las Vegas, NV
Nuremberg, Germany New York, NY
San Francisco, CA
Shenzhen, China Santa Clara, CA National Harbor, MD
Pasadena, CA Rosemont, IL Rosemont, IL Minneapolis, MN
Atlanta, GA
Munich, Germany Montreal, Quebec
San Jose, CA A
3D printing is shaping the future
of manufacturing. This summit will hone participants’ understanding of current 3D printing techniques, mate- rials, bioprinting, and tools, with three days of deep-dive sessions. Sessions at MD&M West take
on a variety of formats. Technical sessions are held on carefully-curat- ed topics that offer specific training for a range of manufacturing tech- nologies and processes. Panel discus- sions will be held by moderators, who will guide conversations with indus- try experts, offering insight into diverse perspectives. Case studies provide a chance
for companies and individuals to dis- cuss strategies, products and busi-
ness models, along with use-case examples of existing or upcoming technologies. Show floor tours offer visitors a guide through the show floor who will focus on a specific industry theme. Visitors will meet the minds behind the products, while discussing questions and ideas as a group. Finally, plenary sessions are open to all conference pass holders and take place just before or after breakout sessions. These offer a chance to join other conference atten- dees for a larger sessions, before
splitting off into elected tracks. Contact: UBM, 2901 28th
Street, Suite 100, Santa Monica, CA 90405 % 310-445-4200 Web:
www.mdmwest.mddionline.com r
Trade Show Calendar MORE SHOWS:
www.topline.tv/tradeshows.cfm
January 9-12, 2018, CES. * Las Vegas Convention Center, Las Vegas, NV. Contact: Consumer Technology Association, 1919 Eads Street, Arlington, VA 22202 % 866-233-7968 E-mail:
cesreg@cta.tech Web:
www.ces.tech
January 31-February 1, 2018, Design Con. * Santa Clara Convention Center, Santa Clara, CA. Contact: UBM Canon, 2901 28th Street, Suite 100, Santa Monica, CA 90405 % 415-947-6105 E-mail:
ian.doyle@
ubm.com Web:
www.designcon.com
February 6-8, 2018, MD&M West. * Anaheim Convention Center, Anaheim, CA. Contact: UBM Canon, 2901 28th Street, Suite 100, Santa Monica, CA 90405 % 310-445-4200 Web:
www.mdmwest.mddionline.com
February 13-15, 2018, The LED Show. * Long Beach Convention Center, Long Beach, CA. Contact: PennWell Corp., 1421 S Sheridan Road, Tulsa, OK 74112 % 918-835-3161 Web:
www.strategiesinlight.com
February 27-March 1, 2018, IPC APEX Expo. *San Diego Convention Center, San Diego, CA. Contact: IPC, 3000 Lakeside Drive, 105 N, Bannockburn, IL 60015 % 847-615-7100 fax: 847-615-7105 Web:
www.ipcapexexpo.org
February 27-March 1, 2018, Embedded World. *NürnburgMesse, Nuremburg, Germany. Contact: NürnburgMesse GmbH, Messezentrum, 90471, Nuremburg, Germany, % +49-9-11-86-06-0 Web:
www.embedded-world.de
March 3-10, 2018, IEEE Aerospace Conference. *Yellowstone Conference Center, Big Sky, MT. Contact: IEEE, 3 Park Avenue, 17th Floor, New York, NY 10016 % 732-562-3878 E-mail:
ieee-mce@ieee.org Web:
www.aeroconf.org
March 4-8, 2018, APEC. *Henry B. Gonzalez Convention Center, San Antonio, TX. Contact: Courtesy Associates, 2025 M Street NW, Suite 800, Washington D.C. 20036 % 202-973-8664 E-mail:
apec@apec-conf.org Web:
www.apec-conf.org
March 14-16, 2018, SEMICON China. *Shanghai New International Exposition Centre. Contact: 673 S Milpitas Boulevard, Milpitas, CA 95035 % 408-943-6900 fax: 408-428-9600 E-mail:
semihq@semi.org Web:
www.semiconchina.org
April 18-19, 2018, Design & Manufacturing New England. *Boston Convention & Exhibition Center, Boston, MA. Contact: UBM, 2901 28th Street, Suite 100, Santa Monica, CA 90405 % 310-445-4200 Web:
www.design-manufacturing-new-england.designnews.com
April 18-19, 2018, BIOMEDevice Boston. *Boston Convention & Exhibition Center, Boston, MA. Contact: UBM, 2901 28th Street, Suite 100, Santa Monica, CA 90405 % 310-445-4200 Web:
www.design-manufacturing-new-england.designnews.com
April 24-26, 2018, NEPCON China. *Shanghai World EXPO Exhibition & Convention Center, Shanghai, China. Contact: Reed Exhibitions (Shanghai) Co., Ltd., 42F Intercontinental Center, 100 Yutong Road, Zhabei District, Shanghai, 200070 % +86-21-2231-7000 fax: +86-21-2231-7181 E-mail:
tim.wang@
reedexpo.com.cn Web:
www.nepconchina.com
May 9-10, 2018, EWPTE. *Wisconsin Center, Milwaukee, WI. Contact: Expo Productions, Inc., 510 Hartbrook Drive, Hartland, WI 53029 % 262-367-5500 E-mail:
cheryl@epishows.com Web:
www.epishows.com
May 15-18, 2018, EDS. *The Mirage Las Vegas, Las Vegas, NV. Contact: EDS, 1111 Alderman Drive, Suite 400, Alpharetta, GA 30005 % 312-648-1140 fax: 312-648-4282 E-mail:
eds@edsconnects.com Web:
www.edsconnects.com
June 5-7, 2018, SMT/Hybrid/Packaging. *Nuremberg Exhibition Centre, Nuremberg, Germany. Contact: Mesago Messe Frankfurt GmbH, Rotebuehlstrasse 83-85, D-70178 Stuttgart, Germany % +49-711-61946-0 fax: +49-711-61946-91 E-mail:
smt@mesago.com Web:
www.smthybridpackaging.com
June 12-14, 2018, MD&M East. *Jacob K. Javits Convention Center, New York, NY. Contact: UBM, 2901 28th Street, Suite 100, Santa Monica, CA 90405 % 310-445-4200 Web:
www.mdmeast.mddionline.com
December, 2017
Page 1 |
Page 2 |
Page 3 |
Page 4 |
Page 5 |
Page 6 |
Page 7 |
Page 8 |
Page 9 |
Page 10 |
Page 11 |
Page 12 |
Page 13 |
Page 14 |
Page 15 |
Page 16 |
Page 17 |
Page 18 |
Page 19 |
Page 20 |
Page 21 |
Page 22 |
Page 23 |
Page 24 |
Page 25 |
Page 26 |
Page 27 |
Page 28 |
Page 29 |
Page 30 |
Page 31 |
Page 32 |
Page 33 |
Page 34 |
Page 35 |
Page 36 |
Page 37 |
Page 38 |
Page 39 |
Page 40 |
Page 41 |
Page 42 |
Page 43 |
Page 44 |
Page 45 |
Page 46 |
Page 47 |
Page 48 |
Page 49 |
Page 50 |
Page 51 |
Page 52 |
Page 53 |
Page 54 |
Page 55 |
Page 56 |
Page 57 |
Page 58 |
Page 59 |
Page 60 |
Page 61 |
Page 62 |
Page 63 |
Page 64 |
Page 65 |
Page 66 |
Page 67 |
Page 68 |
Page 69 |
Page 70 |
Page 71 |
Page 72 |
Page 73 |
Page 74 |
Page 75 |
Page 76 |
Page 77 |
Page 78 |
Page 79 |
Page 80 |
Page 81 |
Page 82 |
Page 83 |
Page 84 |
Page 85 |
Page 86 |
Page 87 |
Page 88 |
Page 89 |
Page 90 |
Page 91 |
Page 92
