December, 2017
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Inventec Intros Co-Solvent for Challenging Defluxing
Deep River, CT — Inventec’s Topklean EL20 product range includes co-sol- vent agents, used with mixed or sepa-
application of conformal coatings, un- derfills or wirebonding processes. Defluxing, the removal of
baked-on solder flux residue post-re- flow from PCBs, is more challenging than ever. This is due to higher den- sities in today’s electronics, minia- turization, low standoff components, and complex geometries. This situa- tion becomes even more difficult in lead-free assembly, where higher process temperatures char the flux residues. Topklean EL20P is the newest
product in the company’s range. It has been formulated to have out- standing capillary action by focusing on two main parameters: the pene- tration coefficient and the solvency power. According to the company, it has a lower surface tension when compared with other co-solvent agents on the market. The high wet- ting performance of Topklean EL20P allows it to efficiently clean lead-free fluxes after reflow. Main benefits include: en- hanced solvency to remove lead-free
flux residue; fast cycle times; low ionic contamination; non-toxic, with very low environmental impact; com- patibility with materials, including labels placed on PCBs before clean- ing; and full compatibility with all leading vapor phase cleaning sys- tems. Contact: Inventec Performance Chemicals, 500 Main Street, Suite
18, Deep River, CT 06417 % 800-435-0317 E-mail:
dreitz@inventec.dehon.com Web:
www.inventec.dehon.com
Page 45
Topklean EL20P co-solvent agent.
rated HFEs (hydrofluoroether) in vapor phase cleaning systems to re- move solder fluxes. This is done before
Dow Intros Thermally Conductive Compound
Midland, MI — Dow Corning has in- troduced its Dow Corning® TC-5888 thermally conductive compound. The new compound offers the
highest bulk thermal conductivity in the company’s thermally conductive compound product lineup. The mate- rial’s thermal conductivity of 5.2 W/m-K, along with its ability to achieve thin bond line thickness of approximately 0.8 mil (20 µm) yields low thermal resistance. The end re- sult is a thermal compound that effi- ciently dissipates heat to improve the performance and reliability of sensi- tive server processors. The TC-5888 thermal compound
also exhibits rheological properties that limit its flow beyond a target in- terface, once assembled. This flow characteristic distinguishes it from lower-viscosity thermal compounds. It provides greater control for applica-
Lowest Cost of Ownership
TC-5888 thermally conductive compound.
tions that require a thicker thermal compound layer or greater precision when dispensing compound between surface interfaces, such as in between large server packages and heat sinks. Contact: Dow Corning Corp.,
2200 W Salzburg Road, Midland, MI 48686 % +32-64-889-350 E-mail:
isabelle.vanderstichelen@
dowcorning.com Web:
www.dowcorning.com
®
www.btu.com
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