December, 2017
www.us-tech.com
Seica Offers Full Range of Test and Soldering Systems
Salem, NH — Seica is offering a re- designed portfolio of test and solder- ing systems, along with its Industry 4.0 industrial monitoring solution.
axial integration of the laser genera- tor, and vision and temperature feed- back of the solder joint.
The company has released its new Dragonfly next > series, an AOI system that provides optical inspec- tion capabilities for standard through-hole components on boards, as well as conformal coating. The system is able to inspect one or both sides of the PCB.
Another restyled product in the lineup is the company’s Pilot FX next
> series, a flying fixture system that fills the gap between flying probe technology and traditional in-circuit bed-of-nails testing. The system has been updated in appearance and given enhanced electrical test capa- bilities. Designed for both in-circuit and functional testing, the Pilot FX next > series tester is built to com- bine the speed of a bed-of-nails tester with the versatility of a flying prober. The company’s industrial moni- toring solution can be used to moni-
tor current absorption, supply volt- age, temperature, light indicators, and other useful process parameters. The software enables predictive maintenance and makes the systems compatible with new expectations for data collection and use. Contact: Seica, Inc., 110 Avco Rd, Haverhill, MA 01835 603-890-6002-76-78 fax: 603-890-6003 E-mail:
sigillo@seica.com Web:
www.seica-na.com
Page 31
Firefly next > series laser soldering system.
The new Pilot V8 next > series flying prober, in its most complete configuration, provides up to 20 mo- bile test resources for a PCB. These range from probes that can supply up to 2A current each, high-resolution cameras for automatic optical inspec- tion, barcode reading and datama- trix, laser, capacitive probes, pyrom- eters, optical fiber sensors for LEDs, and minifixtures for boundary scan and onboard programming to high- frequency probes for measurements over 1.5 GHz.
Seica’s Firefly next > series laser soldering system includes major im- provements over previous models. These include a high-efficiency laser source, a new spot angle on the board, fully-programmable donut spot and
EMS Debuts Adhesive for Camera
Module Lens Holders
Delaware, OH — Engineered Materi- als Systems has launched its 631-68, a UV-cured adhesive for bonding camera module lens holders. The new material is designed to adhere to the engineered plastics used in lens holder assemblies. These materials are engineered to withstand circuit board reliability tests in automotive applications.
The UV-cured adhesive will cure rapidly when exposed to intense UV light, centered at 365 nm. After fixturing with UV, the adhesive can be cured in 15 minutes at 230°F (110°C) or 60 minutes at 176°F (80°C). The new material is the latest addition to the company’s extensive line of electronic materials for semi- conductor, circuit assembly, photo- voltaic, printer head, camera module, disk drive, and photonic applications. Contact: Engineered Materials Systems, Inc., 100 Innovation Court, Delaware, OH 43015 740-362-4444 fax: 740-362-4433
E-mail:
mfrancis@conductives.com Web:
www.conductives.com
Page 1 |
Page 2 |
Page 3 |
Page 4 |
Page 5 |
Page 6 |
Page 7 |
Page 8 |
Page 9 |
Page 10 |
Page 11 |
Page 12 |
Page 13 |
Page 14 |
Page 15 |
Page 16 |
Page 17 |
Page 18 |
Page 19 |
Page 20 |
Page 21 |
Page 22 |
Page 23 |
Page 24 |
Page 25 |
Page 26 |
Page 27 |
Page 28 |
Page 29 |
Page 30 |
Page 31 |
Page 32 |
Page 33 |
Page 34 |
Page 35 |
Page 36 |
Page 37 |
Page 38 |
Page 39 |
Page 40 |
Page 41 |
Page 42 |
Page 43 |
Page 44 |
Page 45 |
Page 46 |
Page 47 |
Page 48 |
Page 49 |
Page 50 |
Page 51 |
Page 52 |
Page 53 |
Page 54 |
Page 55 |
Page 56 |
Page 57 |
Page 58 |
Page 59 |
Page 60 |
Page 61 |
Page 62 |
Page 63 |
Page 64 |
Page 65 |
Page 66 |
Page 67 |
Page 68 |
Page 69 |
Page 70 |
Page 71 |
Page 72 |
Page 73 |
Page 74 |
Page 75 |
Page 76 |
Page 77 |
Page 78 |
Page 79 |
Page 80 |
Page 81 |
Page 82 |
Page 83 |
Page 84 |
Page 85 |
Page 86 |
Page 87 |
Page 88 |
Page 89 |
Page 90 |
Page 91 |
Page 92
