December, 2017


www.us- tech.com New Solder Attach Technologies Streamline Application-Specific Assembly By the Staff of Interplex M


anufacturers have been pre- tinning component solder leads for years, but mostly


for through-hole technology. SMT and lead-free soldering have made


grating the solder within one of the components. For these applications, custom solder attach technology has moved to the forefront as a way to make new designs feasible.


Expanding Range of Applications The ongoing transformation in


automotive electronics is driving an explosion of new features and modu- lar capabilities throughout the car,


from under-hood and drive-train to the passenger cabin. As today’s vehicles become more


dependent on electronics, designers are creating new modules that must be interoperable with existing ones. Solder attach technologies are already playing a critical role in the assembly of individual modules and the stacking of subassemblies, as well as providing interconnects


between modules. The rapid growth of portable


medical devices is being driven by new treatment and testing innovations, as well as an aging population that has greater need for home-care options. Often as small as a mobile phone, portable diagnostic devices are push- ing the need for tighter integration combined with low cost and high relia-


Continued on page 57 ™ Solder attach interconnects.


this type of preparation difficult, until now. Soldering continues to be the


primary method of attachment and electrical connectivity for compo- nents, PCBs, lead frames, wiring, shielding, and interconnections be - tween assemblies such as PCB-to- PCB, modules, daughter-boards, etc. Conventional soldering process-


es for the these applications general- ly consist of multiple steps to bring the parts into position with each other and mechanically hold them in place. This is followed by applying flux and solder to the joined parts before conducting either wave or hand soldering. In recent years, solder attach


technology, which consists of pre- incorporating a very precise amount of solder and flux into interconnects, has greatly improved soldering results and streamlined production processes. Solder attach technology, like


that developed by Interplex, is avail- able in a wide range of interconnects and other products. These have been shown to deliver 100 percent solder- ability, while also eliminating expen- sive and variable secondary processes. These proven solder attach


technologies are now being used for a broader range of custom applica-


Solder attach technology delivers


100 percent solderability while eliminating second- ary soldering processes.


tions. The technology can reduce costs in a wide variety of application- specific product designs. While off-the-shelf solder attach


components can offer many options for quickly and cost-effectively improving solderability, there will always be unique product require- ments that cannot be met by stan- dardized parts. Product-specific con- straints, such as limited space, unique form factors and special alloys, may limit the usability of standard solder attach parts. These products still require a high level of solderability and manufacturing effi- ciency. Virtually any field that requires


the joining of metal parts with solder is a candidate application for inte-


Spacers & Standoffs Plugs & Jacks Multi-Purpose Hardware IT’S WHAT’S ON THE INSIDE THAT COUNTS ® ELECTRONICS CORP. www.keyelco.com  (516) 328-7500 (800) 221-5510 INTERCONNECT COMPONENTS & HARDWARE


Page 55


Battery Clips, Contacts & Holders


Fuse Clips & Holders


Terminals and Test Points


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