guarantees outstanding defect detection and high through-put
3D Solder Joint Inspection on PCB Bottom Sides
Viscom brings its great THT competence into line with its long- standing experience in developing high-quality 3D inspection systems for SMD production. The S3016 ultra is perfectly suited for inspecting SMD, THT and pressfit components as well as selective solder joints from below. Even under extreme cycle time require- ments, the system’s high-performance camera technology ensures the greatest inspection depth.