search.noResults

search.searching

dataCollection.invalidEmail
note.createNoteMessage

search.noResults

search.searching

orderForm.title

orderForm.productCode
orderForm.description
orderForm.quantity
orderForm.itemPrice
orderForm.price
orderForm.totalPrice
orderForm.deliveryDetails.billingAddress
orderForm.deliveryDetails.deliveryAddress
orderForm.noItems
Page 64


www.us- tech.com


December, 2019 High-Rel Quartz Crystals from Diodes Inc.


Plano, TX — Diodes Incorporated has intro- duced a series of automotive-compliant timekeeping crystals that withstand harsh operating conditions to ensure outstanding accuracy and reliability in tire-pressuring monitoring systems (TPMS), infotainment, telematics, and advanced driver assistance systems (ADAS). Capable of sustained operation at cen-


trifugal forces up to 1,500 g, the new XRQ crystals pass the Society of Automotive Engineers (SAE) J2657 specification for TPMS, now a mandatory safety feature for new cars. The XRQ series crystals are resistant to


shocks up to 8,000 g, which is significantly higher than the standard. They also surpass industry-standard JIS-C0044 drop tests by


XRQ series timekeeping crystals.


surviving falls of up to 3.9 ft (1.2m). XRQ crystals meet the requirements


of ultrasonic welding manufacturing processes, which are cleaner than tradi- tional processes and used when manufac- turing hermetically sealed objects, such as a TPMS. The process can be used to pro- duce automotive components that must provide superior precision and reliability. The XRQ series is well-suited for


automotive applications, both under the hood and in passenger compartment loca- tions. It is AEC-Q200 qualified and avail- able in Grades, 1, 2 and 3 temperature ranges. XRQ devices are PPAP-capable and are manufactured in IATF16949-certi-


fied facilities. Contact: Diodes, Inc., 4949 Hedgcoxe


Road, Suite 200, Plano, TX 75024 % 972-385-6292 E-mail: glen_wynn@diodes.com Web: www.diodes.com


NT100Ge


Solder Smarter A seamless replacement for SN100C®


Compete at a higher level with NT100Ge. Available in solder bar and wire, NT100Ge has an identical chemical composition and is a seamless drop-in replacement for the well-known SN100C® solder. Produced with the highest quality raw materials and delivering the industry’s best price-performance ratio, NT100Ge lowers cost of ownership, raises competitiveness and produces high-integrity interconnects.


DTI Develops ESS Klystron Production Test Stand


Bedford, MA — Diversified Technol - ogies, Inc., (DTI) has delivered a new, long-pulse modulator klystron test stand to Commun ication and Power Indus tries (CPI) of Palo Alto, California. The system is designed to perform the full power testing of pro- duction VKP-8292A klystrons for the European Spallation Source (ESS). The DTI ESS klystron produc-


tion test stand permits the testing of klystrons at full ESS specifications — 120 kV, 50A, 3.5 ms pulse, 14 Hz with margin for operating voltages at


Long-pulse modulator klystron test system.


up to 130 kV. Eliminating flicker, the design is based on a patented non- dissipative regulator that compen- sates for the capacitor droop voltage of approximately 20 percent during the pulse. The DTI ESS klystron produc-


tion test stand will speed delivery for ESS klystrons and similar long- pulse, high-power klystrons at CPI. Fully integrated with cabinets,


Additional solder alloys: SAC305 / SAC0307 / Sn63 / 99C / NT100GeX


www.nathantrotter.com


HVPS, modulator, and transformer, earlier versions of this design are in use at IPN Orsay and CEA Saclay in France to test RF components for ESS.


Contact: Diversified Technologies, Inc., 35 Wiggins


Avenue, Bedford, MA 01730 % 781-275-9444 E-mail: kempkes@divtecs.com Web: www.divtecs.com


Page 1  |  Page 2  |  Page 3  |  Page 4  |  Page 5  |  Page 6  |  Page 7  |  Page 8  |  Page 9  |  Page 10  |  Page 11  |  Page 12  |  Page 13  |  Page 14  |  Page 15  |  Page 16  |  Page 17  |  Page 18  |  Page 19  |  Page 20  |  Page 21  |  Page 22  |  Page 23  |  Page 24  |  Page 25  |  Page 26  |  Page 27  |  Page 28  |  Page 29  |  Page 30  |  Page 31  |  Page 32  |  Page 33  |  Page 34  |  Page 35  |  Page 36  |  Page 37  |  Page 38  |  Page 39  |  Page 40  |  Page 41  |  Page 42  |  Page 43  |  Page 44  |  Page 45  |  Page 46  |  Page 47  |  Page 48  |  Page 49  |  Page 50  |  Page 51  |  Page 52  |  Page 53  |  Page 54  |  Page 55  |  Page 56  |  Page 57  |  Page 58  |  Page 59  |  Page 60  |  Page 61  |  Page 62  |  Page 63  |  Page 64  |  Page 65  |  Page 66  |  Page 67  |  Page 68  |  Page 69  |  Page 70  |  Page 71  |  Page 72  |  Page 73  |  Page 74  |  Page 75  |  Page 76  |  Page 77  |  Page 78  |  Page 79  |  Page 80  |  Page 81  |  Page 82  |  Page 83  |  Page 84  |  Page 85  |  Page 86  |  Page 87  |  Page 88  |  Page 89  |  Page 90  |  Page 91  |  Page 92