New Products
of stencil technology and related tool-
ing to accommodate various production
easy and precise monitoring of cleaning baths
demands; and 3) providing comprehensive
The use of concentrated cleaning agent is a
process management to ensure quality, on-
cost-effective solution. However, drag-out and/
time delivery, and product uniformity on
or dilution can cause the concentration of the
a global basis. The three-pronged approach
cleaning agent to change over time, necessitat-
starts with a comprehensive product offer-
ing continuous monitoring of the bath. The
ing of stencils, screens, blades and related
newly developed ZESTRON® Bath Analyzer
tooling. The design aspect provides CAD
is an easy to use monitoring kit that can be
services, including design review and check
applied in just a few steps, with no specific
plots, design library standardization and
operator training required. The Bath Analyzer
management and weekly reporting. iPASS
is applicable for alkaline as well as pH-neutral
process management includes training,
VIGON® and ATRON® cleaning agents.
managed product rollout, order confir-
www.zestron.com
mation and on-time delivery, and data
reporting, all integrated within an ISO
New Switch-a-pitch adapters lorD corporation develops
9001:2000 framework.
www.photostencil.com
provide even smaller pitch landing thermally conductive no pump-out
pads for use on larger pitch boards grease
Aries Electronics has expanded its line of LORD Corporation’s TC-501 grease—“the
BGA Switch-A-Pitch adapters that simplify Intelligent Grease”—is a no pump-out mate-
high density interconnect (HDI) construc- rial that replaces greases used as thermal
interface materials (TIM) between the
heat spreader and the heat sink (com-
monly known as TIM2). TC-501 Grease,
a silicone TIM, provides high thermal
conductivity and low thermal resistance
for applications in which superior heat dis-
sipation is required. Unlike commercially
available greases that eventually pump out,
Mill-Max adds gull wing SMT .070”
LORD TC-501 grease was developed using
pitch ShrinkDip & Sip sockets and
tion to enable the use of smaller pitch proprietary technology that prevents pump-
headers
devices on larger pitch boards. The series out.
www.intelligentgrease.com
Mill-Max series 117, 127, 217 & 227
now includes models with tops where
shrinkDIP sockets accommodate memory
the BGA landing pads are on a 0.40 mm ecD introduces Map software ver-
chips and components that have pin-to-pin
pitch and adapter bottoms are populated sion 2.17c with additional thermal
spacing of .070” (1.778mm). The reduced
with BGA balls on a 1.27 mm pitch. The
profiling benefits
pattern of the shrinkDIP series also saves
new adapters significantly reduce costs
ECD’s most recent upgrade to its MAP®
valuable board space for board-to-board
because designers can use readily available,
(Machine, Assembly, Process) software
connections as more pin connections
and therefore less expensive, larger pitch
incorporates suggestions from Celes-
can be made using less “real estate” than
boards. In addition, manufacturers can
tica, Intel, Accu-Rite and Silicon Forest
standard .100” pitch patterns. They can
add components to designs at much lower
Electronics, reflecting real-world improve-
also be mated with series 162 shrinkDIP
costs, since the adapter tops leave open
ments, not just upgrades for the sake of
headers for board-to-board connections.
space around the location for the replace-
announcing something new. New features
www.mill-max.com
ment device.
www.arieselec.com
include a cropping tool to easily remove
extraneous data, profile data extraction for
Cooling Slopes After Peak, batch down-
load of multiple runs stored on ECD’s
high-lead and lead-free capable multicore die attach solder paste MEGAM.O.L.E.®20 and V-M.O.L.E.®,
Henkel has launched a new high-lead and lead-free capable die attach solder paste date-time auto file naming option, and
for enhanced thermal control of power devices under their leading Multicore® one-click direct-to-Excel data exporting in
brand of solder materials. Multicore® DA100 incorporates a no clean, ROLO flux user-specified units.
system that can be used for high-lead applications and uniquely offers capability for Customers can download MAP®
lead-free processes as well. Using specific high temperature Pb-free alloys to offer the V2.17c by visiting
www.ecd.com/
same thermal control necessary for today’s rectifiers, power transistors, amplifiers downloads. Online training for MAP®
and many other consumer and automotive components, Multicore DA100 effectively V2.17c software, as well as for other ECD
complies with the environmental goal of lead elimination in power packages by 2013, products, is available online at no charge
as stipulated by ROHS legislation. Furthermore, packaging specialists that wish to use through ECD-U. To find a convenient
high-lead solders today, can easily move to lead-free solders tomorrow, while utilizing class, consult the schedule at
www.ecd.com/
the same flux system offered through Multicore® DA100. This ability to employ a ecd-u.
consistent flux system is extremely beneficial to customers, as it minimizes the impact
of flux reliability evaluation programs for such critical elements as cleanability, wire
bonding and molding, among others.
www.henkel.com/electronics
48 – Global SMT & Packaging – September 2009
www.globalsmt.net
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