Special packaging feature: Imbedded Component/Die Technology: Is it ready for mainstream design applications?

packaging technology for use in products
that must operate in harsh environments
12
.
The two test vehicles discussed in this pa-
per have proven that the design guidelines,
materials, and process parameters used to
manufacture IC/DT® assemblies are capa-
ble of withstanding temperature, humidity,
and shock stresses. Test Vehicle 1 (daisy-
chain sample) survived over 3000 cycles of
thermal shock exposure before a failure oc-
curred. Test Vehicle 2 (mixed-signal proto-
type) was bench tested to meet and exceed
legacy product performance specifications
in order to qualify the prototypes as flight
hardware. Lastly, a successfully flight test
of the mixed-signal prototype in October
of 2006 was paramount in demonstrating
IC/DT’s® ability to meet form, fit, and
function requirements in a miniaturized
robust package.
Future designs requiring SWAP and hi-
reliability requirements now have a design
suite (IC/DT®) capable of meeting their
requirements for future design objectives
for lighter, smaller, and less power require-
ments. As shown earlier in technology
prototypes, the test vehicles have proven
their reliability characteristics by long term
environmental testing as well as success-
fully being flown in actual systems. So the
answer is “YES” to the question that IC/
DT® is now ready for mainstream design
engineering/applications.
acknowledgements
The findings of this study could not have
been accomplished without the support
of the STI Microelectronics Lab and the
STI Analytical Lab under the direction of
Mark McMeen. The authors would like to
acknowledge the efforts of Jonnie Johnson
and David Robinson for support of the
design, assembly, and test of the prototype
assemblies.
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