Contents
Award Winning Products and Service
Volume 9, No. 9
September 2009
American edition
Global SMT & Packaging
is published monthly
by Trafalgar Publications
Contents
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2 China on the rise, but patchy picture elsewhere 14
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Trevor Galbraith
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Global SMT & Packaging, c/o
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14 A baseline study of stencil and screen print processes for
365 Blair Road, Avenel, NJ
wafer backside coating
07001.
Jeff Schake, DEK USA, Inc.
28
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28 Imbedded Component/Die Technology: Is it ready for
electronic, mechanical, photo-
mainstream design applications?
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Casey H. Cooper, Mark T. McMeen and Jim D. Raby, STI Elec-
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34 IC packaging and interconnection technologies’ 4th dimen-
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Joseph Fjelstad
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ISSN No. 1474-0893
36 Interview—Mike Nelson, Etek Europe
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42 IPC Midwest technology preview
44 SMTA International technology preview
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4 IC packaging technology retrospective—part 7
Joe Fjelstad
22 Fatigue and creep wearout failures in
electronics—a historical retrospective
Walt Custer and Jon Custer-Topai
38 Fatigue & creep wearout in electronics:
a historical retrospective
Werner Engelmaier
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6 Industry News
MV-3 Desktop AOI Series
PoP technology is not without
46 New Products
MV-7 Inline AOI Series
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50 Association News
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52 International Diary
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