Special packaging feature: IC packaging and interconnection technologies’ 4th dimension challenge

co-founder of Sun Microsystems, appears Verdant Electronics founder and president
to be taking up where Cray left off, as Joseph (Joe) Fjelstad has more than 35 years of
evidenced in a recent New York Times “In the world of international experience in electronic intercon-
article by John Markoff . In the article,
Markoff reported that “some of the fastest
electronics design and
nection and packaging technology in a variety
of capacities from chemist to process engineer
supercomputers slow to a crawl when they
manufacture, we are
and from international consultant to CEO. Mr.
are given types of problems that require
Fjelstad is also a well known author writing on
the movement of significant amounts
racing through time the subject of electronic interconnection technol-
of data between processors.” Markoff
continued with “Mr. Bechtolsheim to gain time.”
ogies. Prior to founding Verdant, Mr. Fjelstad
co-founded SiliconPipe a leader in the develop-
thought he had found a solution to
ment of high speed interconnection technologies.
that problem by modifying an industry
He was also formerly with Tessera Technologies,
standard data switch, making it possible
a global leader in chip-scale packaging, where he
for any of the 13,000-plus Advanced Micro
was appointed to the first corporate fellowship
Devices Barcelona microprocessors to
communicate with each other more than
for his innovations.
10 times as fast as with existing switches.”
In summary, in the world of electronics
design and manufacture, we are racing
through time to gain time. The progression
from megaflops, to gigaflops, to teraflops
and now to petaflops are all fundamentally
measures of time, and interconnection,
it turns out, is the time keeper. As
the electronics industry continues to
AMD’s Opteron, codenamed Barcelona.
pass through time, IC packaging and
interconnections approaches will become
ever more so; the gate keepers of time and
of IC packaging and interconnection will
the mastery of the 3rd dimension by means
provide the key.
www.globalsmt.net Global SMT & Packaging – September 2009 – 35
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