Join us in San Diego
at SMTAI–the industry’s leading conference on
electronics assembly and advanced packaging.
October 4-8, 2009 s San Diego, CA
Town and Country Resort and Convention Center
Technical Conference | October 4-8, 2009 Electronics Exhibition | October 6-7, 2009
The industry’s strongest program on electronics A technology showcase featuring products and
assembly and advanced packaging services from leading suppliers to our industry
Show preview: SMTA International 2009
ANNIVERSARY
Tec
Come. F
hnology pr
ocus.
eview:
For more inf
What’s on the sho
ormation visit www.smta.org/smtai or call 952.920.7682
w floor?
Global SMT & Packaging magazine previews just some of the
innovations and new technology to be showcased on the floor at
this year’s SMTA International conference and exhibition.
SMTA International
October 4-8, 2009
Town & Country Resort
and Convention Center,
San Diego, California
www.smta.org/smtai
connectors or other devices without the
printing. The advanced rheol-
need for changing nozzle sizes. This is done
ogy of Indium8.9HF is ideally
automatically during production. No other
suited for today’s advanced
machine in this market has this ability.
0.4mm pitch and 0201
aqueous Technologies—booth 408
This adds much needed flexibility to the
technologies. Indium8.9HF
Aqueous Technologies Corp. is bringing
process, allowing various soldering options
possesses a unique activator
its Trident III automatic defluxing and
with no changeover. www.jukiamericas.com
package and outstanding oxi-
cleanliness testing system to IPC Midwest.
dation barrier, which allows
Trident III is capable of removing all flux
it to coalesce and wet as good
residues including rosin, no-clean and
as, or better than, its halogen-
water soluble. Both lead and lead-free flux
containing counterparts. The
residues may be removed using the system,
oxidation barrier also ensures
and it is equipped with an automatic
there is no graping on small
chemical injection system that auto-
passives. www.halogen-free.com
matically adds a programmable volume of
defluxing chemical to the wash water. The
Juki automation Systems—
company will also be exhibiting its Zero-Ion
booth 205
G3 cleanliness tester. www.aqueoustech.com
Juki will exhibit its FlexSolder W510,
which is able to handle dual mini-waves
indium corporation—booth 609
for simultaneous or individual use. The
Indium8.9HF solder paste is a halogen-free
advantage of individual use is having the
kyzen—booth 203
Pb-free solder paste with unsurpassed print
ability to solder closer than 1mm to other
Kyzen’s AQUANOX® A4241 PCB and
transfer efficiency and response-to-pause
SMD, but also being able to solder large
stencil cleaner has been designed with revo-
44 – Global SMT & Packaging – September 2009 www.globalsmt.net
Page 1  |  Page 2  |  Page 3  |  Page 4  |  Page 5  |  Page 6  |  Page 7  |  Page 8  |  Page 9  |  Page 10  |  Page 11  |  Page 12  |  Page 13  |  Page 14  |  Page 15  |  Page 16  |  Page 17  |  Page 18  |  Page 19  |  Page 20  |  Page 21  |  Page 22  |  Page 23  |  Page 24  |  Page 25  |  Page 26  |  Page 27  |  Page 28  |  Page 29  |  Page 30  |  Page 31  |  Page 32  |  Page 33  |  Page 34  |  Page 35  |  Page 36  |  Page 37  |  Page 38  |  Page 39  |  Page 40  |  Page 41  |  Page 42  |  Page 43  |  Page 44  |  Page 45  |  Page 46  |  Page 47  |  Page 48  |  Page 49  |  Page 50  |  Page 51  |  Page 52  |  Page 53  |  Page 54  |  Page 55  |  Page 56