Looking forward—following a difficult 1H’09
outsourcing its small form factor PC • Horizon Sales as its representative for manager.
barebones and system manufacturing. Michigan, Indiana, Ohio, Kentucky • opened a new sales and support office
SMART Group celebrated its 25th and western Pennsylvania. in Penang, Malaysia.
anniversary. • LaPa Enterprises as its representative in LEM acquired Danfysik ACP A/S.
SMTA created the smta.org/25 website for
Northern California, Nevada.
Manncorp introduced a dual-pot wave
25th anniversary.
• Process Solutions Associates as its
solder machine for lead-free or tin-lead
Ultra Manufacturing Services Cambridge
representative in Illinois.
processing.
secured a new Aerospace electronic
• Tonka Electronics as its representative
Microscan:
manufacturing contract.
for ND, SD, MN and IA.
• moved to a new, larger corporate head-
UEC Electronics:
Cogiscan and Microscan entered strategic
quarters and manufacturing facility in
• entered into a mentoring partnership
partnership for joint product development
Renton, Washington.
with Raytheon.
and cross selling of each company’s
• was named one of “Washington’s 100
• opened a 19,000 SF manufacturing
products.
Best Companies to Work For 2009” by
and electronics integration operation
Creative Materials (Tynsboro, MA) Seattle Business Magazine.
in Hanahan, South Carolina.
introduced a flexible UV coating which
MIRTEC received contracts totaling more
Victron named Todd Lovejoy CTO.
can be used as crossover layer for polymer
than $15M for its MV-7xi inline AOI
Winland Electronics renewed its line of
thick-film conductive inks in printed
systems from leading mobile solution
credit with M&I Bank.
circuit applications.
manufacturers.
Wistron is investing US$100 million to
DEK:
Mitsubishi Electric and Kyoto University
establish its third notebook manufacturing
• appointed Spectronic Technology as a
jointly developed a robot system designed
plant in Taizhou, China.
franchisee for laser-cut stencil manu-
for assembling small electronics.
facturing.
Mitsubishi Materials commercialized
Materials & process equipment
• donated a Horizon 03i printing system
a lead-free solder paste with ultra-fine
Taiwan equipment makers canceled
to Cal Poly, San Luis Obispo.
powder for formation of narrow-pitch
unpaid leave policy due to recovering
Dow Chemical /Rohm & Haas head of
bump measuring 100 micron meter or less
demand.
Dow Advanced Materials, Pierre Brondeau,
using Sn-Cu binary alloy.
3M released an UPC tape for protecting
retires September 2009, to be replaced by
Oki Electric developed lead-free soldering
and transporting small electronic
Jerome Peribere.
technology with static pressure process
components.
Enthone (Cookson Electronics) acquired
for the large size high-density multilayer
Adept Technology received a $2.5 million
Westbrook Technologies.
boards.
vision-guided robot order from a leading
Essemtec added a jet valve dispensing
Optomec and Vertical Circuits formed
international consumer electronics
system to its FLX2011-MK, enabling it to
an ultra-fine pitch 3D interconnect R&D
manufacturer.
place smaller SMD components and LEDs
partnership.
Agilent acquired Varian for $1.5 billion.
on flexible circuits.
Orbotech Japan introduced its “Paragon-
Aqueous Technologies opened Aqueous
EVS appointed Etek Europe for solder
Ultra 80” LDI system for FC-CSP substrate
University Online at
dross recovery equipment sales in the UK,
manufacturing with 40 micron pitch
www.aqueoustech.com/aquuniv.
Eastern Europe and the Ukraine.
traces.
Asada Mesh commercialized a new HS-
Fancort Industries became a North
Orpro Vision:
D500 metal mesh with a high tensile
American distributor of Japan UNIX
• named SMA Technologies its represen-
strength of 3000 N/mm for high precision
robotic laser soldering systems.
tative for Brazil.
screen-printing.
Frontline PCB Solutions (Orbotech— • unveiled new www.orprovision.com
ASYS became an exclusive representative
Valor Company) released its Genesis 2000 website.
for Viscom’s AOI and x-ray equipment for
version 9.5 CAM system. •
the Brazilian market.
Henkel formulated an advanced die attach • Park Electrochemical:
Bliss Industries appointed:
solder paste suitable for both high-lead and • appointed Anand Kathula VP of engi-
lead-free applications. neering for its Park Aircraft Technolo-
Isola president gies subsidiary.
20090814
World PCB Monthly Shipments
of N America, • President and CEO Brian Shore sold
Converted @ Constant 2007 Exchange Rates
Matt LaRont, 60,000 shares of Park’s common stock.
3500
received expanded Photo Stencil appointed Steven Cooper
N America Europe Japan SE Asia
responsibilities as North America sales manager.
3000
global supply chain Rogers:
2500
officer. • introduced RO4730 LoPro laminates
JUKI Automation for base station, RFID and other
2000
Systems Europe antenna designs.
updated its website • invested $5 million in Solicore (Lake-
1500
www.jas-smt.com. land, Florida).
1000
Kester appointed RoodMicrotec completed €1.8 million
Adrian Hawkins bank refinancing.
500
Ph.D. as technology Shikoku Chemicals introduced new PCB
0 and development soft-etching agent for Asian markets.
1 3 5 7 9111 3 5 7 9111 3 5 7 9111 3 5 7 9111 3 5 7 9111 3 5 7 9111 3 5 7 9111 3 5 7 9111 3 5 7 9111 3 5 7 9111 3 5 7
99 00 01 02 03 04 05 06 07 08 09
manager. Taiyo America became DMR’s exclusive
CALENDAR YEAR
Kyzen: manufacturer of Silver Bullet PEC printed
Source: Custer Consulting Group
• named Rich electronic inks.
Brooks south- Taiyo Industries acquired Micro
Chart 11. western regional Engineering.
26 – Global SMT & Packaging – June 2009 www.globalsmt.net
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