www.globalsmt.net
The Global Assembly Journal for SMT and Volume 9 Number 9 September 2009
Advanced Packaging Professionals
ISSN 1474 - 0893
PoP (Package on Package) and vaPor
Phase technology
Mike Nelson
Interview Inside
a baseline study of stencil and screen
Print Processes for wafer backside
coating
NEW PRODUCTS
fatigue & creeP wearout in INDUSTRY NEWS
electronics: a historical
retrosPective
INTERNATIONAL DIARY
sPecial Packaging feature:
imbedded component/die
Plus:
technology (ic/dt®):
ic packaging and
interconnection
is it ready for mainstream
technologies’ 4th
design applications? dimension challenge
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