Special packaging feature: Imbedded Component/Die Technology: Is it ready for mainstream design applications?

extreme temperatures
• Encapsulant—determine war-
page and stress due to modulus
and CTE differential of encap-
sulant and assembly (silicon
The Award Winning
die, laminate substrate, metal
core, aluminum wire bonds)
Dage XD7600NT
100
HP
Continuity testing was performed prior to
cycling to establish a baseline resistance
The Ultimate in X-ray Inspection
for each of the daisy-chains and at periodic
intervals to monitor resistance fluctua-
tions. Five daisy-chain die were imbedded
within the test coupon thus providing 30
daisy-chains, equivalent to 60 wires (120
bonds), for monitoring. A 3.0 Ω increase
in resistance constituted a failure with the
cycles-to-failure data noted in Table 1. The
first failure/high resistance bond occurred
after exposure to 3000 cycles with a lapse
of 1500 cycles till the second noted failure.
Only 23% of the wires had failed after
5500 cycles when the test coupon was
pulled from cycling.
The failure data gathered from this
test vehicle is indicative that the material
properties selected will provide the long-
term reliability solution for critical military
electronics hardware. Compliant die attach
adhesive enables stress relief from thermal
N Unique Dage NT100 sealed-transmissive X-ray
induced stress in the silicon die-to-substrate
tube providing feature recognition down to
interface while the wire bonds, coupled
with a compliant encapsulant, provide the
100nm (0.1 microns)
stress relief from environmental induced
N Unique 10 watts power at sub-micron
stress (thermal movement, mechanical
feature recognition
shock, and vibration). This material set for
packaging electronics, in conjunction with N 2.0 Mpixel images with >65,000 greyscale levels
the IC/DT® design guidelines, enables the
all displayed on a 24” HD monitor
manufacturing of robust, reliable electron-
ics assemblies.
N CT Option
See what the XD7600NT
Test vehicle 2
100
HP can do you for at:
A mixed-signal test vehicle (Figure 4) was
Productronica 2009: Stand A2:361
designed and assembled to serve as a
technology demonstration for the Navy’s email: dpi-sales@dage-group.com
Standard Missile-2 (SM-2) program. The
www.dage-group.com
Navy’s SM Program Office used this
prototype in a flight test to support a tech-
nology demonstration of the Imbedded
Component/Die Technology, validating
the electrical and mechanical performance
ICs were procured as unpackaged compo- tiple tiers were exposed in the substrate
of this new and innovative electronics-
nents (wire bond face-up die), and passives with strategic placement of components to
packaging concept. An IC/DT® prototype
DG-2811 XD7600NT Colour Ad.v2.indd 1 20/8/09 11:56:55
with gold metallization were procured for decrease interconnect length (component-
was designed with a mix of analog and RF
imbedding into the prototype. Through to-component bonding and component-to-
circuitry using imbedded design practices
elimination of the secondary packag- substrate bonding) and address power dis-
with wire bondable devices. The prototype
ing, a 66% reduction in surface area was sipation. High-power devices were bonded
circuit design was selected to demonstrate achieved. This reduction enables the with thermally conductive adhesive
the IC/DT® packaging technology’s capa- integration of future CCAs into a single directly to an imbedded thermal core in
bility to address miniaturization, thermal assembly module (increased form, fit, and the substrate. This eliminates the need for
dissipation, component obsolescence, and function through added capability within external heat sinks and lowers the devices’
reliability. the same footprint). junction temperature, thus increasing
Miniaturization objectives were largely All components, both actives and device performance and longevity
9
.
achieved due to the ability to locate wire passives, were imbedded into cavities (Z-
Flexible interconnects (Figure 5), such
bondable components for the circuit. All direction) in the laminate substrate. Mul-
as aluminum wire bonds, were used to
www.globalsmt.net Global SMT & Packaging – September 2009 – 31
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