New Products
New products
Seika Machinery features yJ link
accurately than other systems because
conveyor systems
it “shoots” the dots instead of “pulling
Seika Machinery, Inc., now features Young
them off,” which is common for needle
Jin Conveyors for SPI and AOI. YJ Link’s
dispensing. The higher accuracy of the dots
SPI NG/Good Buffer is designed to stack
enables the placement of smaller compo-
NG PCBs and transfer good PCBs to the
nents such as 0603 chips or below. The
next process using FIFO. This method pro-
second dispenser can be an Archimedean
vides increased line efficiency and requires
screw type, a time/pressure system with a
only minimal space for equipment. Using
Piezoflow valve or a second jet valve. The
the SPI NG/Good Buffer, there is no need
assembly head features optical centering.
to filter NG PCBs and SPI operates nor-
Production of double-sided flex boards is
mally, even during NG PCB verification.
also possible.
www.essemtec.com
erSa ir/pl 650 Xl big board rework
YJ Link’s AOI NG Buffer stacks NG PCBs
machine
and pushes good PCBs to the next AOI
Manncorp introduces under $25,000
For today’s rework operators working on
inspection process.
large PCBs, one truth remains constant—
www.seikausa.com.
rework difficulty increases with the size of
the PCB. ERSA’s new IR/PL 650 XL is
essemtec’s FlX2011-Mk places
their flagship rework system for extra large
smaller components on flexible
PCBs. Boards up to 20” x 24” or 500 mm x
circuits
625 mm can be safely and rapidly reworked
The FLX2011-MK, Essemtec’s production
using one of the industry’s largest and most
center assembles complete flexible circuits.
powerful bottom side heaters—an 8,000 W
The machine dispense glue, solder paste or
medium wavelength IR heater measuring
conductive adhesives,
500 mm x 625 mm. These extra powerful
and it places SMT
bottom & top heaters are necessary for
components, LEDs
large boards, especially for those which
and snap discs, all
high-mix placer; processes 0402s,
are thicker than 3 mm. Unless the entire
within one minute.
QFps & Bgas
board area is efficiently preheated from the
One of the two
Manncorp now offers a pick-and-place
bottom, such boards show the tendency of
dispensers on the
machine with a broad range of capabilities
bending and warping during the rework
FLX2011-MK is a
and extraordinary versatility at reportedly
procedure. The PCB table exposes the en-
jet valve dispensing
breakthrough pricing. The new 7722FV
tire PCB to the heater area—no cold spots
system that features
will mount most of today’s fine-pitch com-
mean less warping. The IR/PL 650 XL
contactless meter-
ponents with ±0.1 mm placement accuracy
system also features a highly efficient com-
ing of adhesive. It is
for chips, including 0402s. Accuracy for
pressed air cooling system.
www.ersa.com
able to meter small
mounting SOICs, QFPs and BGAs to 40
dots faster and more
mm square with 15-mil pitch is ±0.05 mm.
7722FV has a generous 56-feeder capacity
and a 6,000 dots-per-hour dispense option.
7722FV meets prototyping and low-volume
demands and is said to be particularly
suitable for OEMs bringing PCB assembly
in-house. In higher-volume assemblies, it
can also be used whenever modifications
are required within the same board run.
The 7722FV is under $25,000 with an in-
troductory offer of a $2,945 feeder package
kic debuts next generation wave surfer measurement system
included at no added cost.
KIC releases the second generation Wave Surfer, an easy-to-use, self-contained measure-
www.manncorp.com
ment system for wave solder machines that provides critical data on wave solder machine
setup and its process. As a wave solder machine profile fixture, Wave Surfer has five
resilient chip encapsulants provide
embedded thermocouples and works in conjunction with your KIC profiler for quick and
superior protection
easy profiling and wave solder machine setup. Made of a material similar to typical wave
DYMAX Multi-Cure® 9001-E Series encap-
solder pallets, the Wave Surfer can withstand thousands of passes. The fixture holds the
sulants cure in seconds to provide superior
profiler in place during each run to measure the pertinent process data in the wave solder
moisture and abrasion resistance and ther-
machine including peak temperature, dwell time, parallelism, and conveyor speed. www.
mal cycle performance of electronic and
kicthermal.com
microelectronic assemblies. The fast cure
46 – Global SMT & Packaging – September 2009
www.globalsmt.net
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