This page contains a Flash digital edition of a book.
news digest ♦ Equipment and Materials


very best training, in order to ensure machines are maintained and used to their full capabilities. While Oxford Instruments offers extensive Customer Support maintenance & service packages, it is always beneficial for customers to have enough knowledge to maintain and run their own machines on a day-to-day level. These courses aim to assist Customers in achieving this.


The new course schedule includes training on PlasmaPro System 80/800, PlasmaPro System 100/133, PlasmaPro NGP 80, PlasmaPro NGP1000, plus the HINE/EMS Robotic transfer arm, and End point detection.


Pete Hunt, Oxford Instruments Customer Service and Support Manager comments, “As a leader in system manufacture for both the Production and R&D markets, we realise the importance of machine maintenance and uptime. Our courses are designed to improve process knowledge and system maintenance techniques for engineers and technicians. They are given by our experienced Training Officer, Nick Curtis, with the support of the Company’s process and system engineers, who not only know the systems but understand our Customers’ individual requirements.”


OIPT says customer feedback on training has been excellent, with participants finding both the theory and practical sessions beneficial and well organised. As Hilary Tanner of L-3 EOS commented, “You supplied good, solid, thought- provoking information”


In order to provide the very best training packages, course numbers are limited so that participants gain a real insight at first hand into the machines.


Johnson Matthey purge systems popular in U.S. and Europe


China and Taiwan are still the largest markets for the firm’s products used in compound semiconductor manufacturing. JM expects its GPT PureGuard V-Purge System sales to be strong in 2012 based on the fact that long-term LED market opportunities remain very positive.


234 www.compoundsemiconductor.net November/December 2011


Johnson Matthey’s Gas Purification Technology (GPT) group announced that 2011 sales of its PureGuardTV-Purge System to compound semiconductor manufacturers are up in the U.S. and Europe.


Johnson Matthey, a designer, manufacturer and distribution of point-of-use gas purification equipment to the global electronics industry, has shipped its PureGuard V-Purge Systems, hydrogen purifiers and other offerings to new and expanding fabs for sensitive semiconductor and analytical applications, including compound semiconductor, crystal growth and PV deposition processes.


“While China and Taiwan are still the largest markets for our products,” said Jeff Lucht, GPT group Business Manager, “V-Purge System sales are strong in the U.S. and Europe. These systems are designed to meet the needs of today’s largest MOCVD production platforms, particularly for manufacturing high brightness (HB) and other types of LEDs.”


Lucht said that he expects GPT PureGuard V-Purge System sales to be strong in 2012 “based on the fact that long-term LED market opportunities remain very positive.”


The V-Purge System enhances the performance of Johnson Matthey and other hydrogen purifiers for higher flow rates typical in production fabs. The patented system employing palladium membrane technology offers flow rates between 1 and 200 slpm and removes water, oxygen, carbon monoxide, methane, nitrogen, carbon dioxide and THC to produce the purest possible hydrogen.


The system provides heat management capable of handling any flow change, superior protection from power failure and pressure surges and can switch from full nitrogen to full hydrogen immediately. When the automated purge is activated, it takes the V-Purge System minutes to remove all hydrogen.


Earlier this year Johnson Matthey’s GPT group reported that 2010 Asia sales increased dramatically for its leading and highly reliable bulk and point-of-use PureGuard PSH Series hydrogen purifiers, thanks largely to the continuing rapid growth of LED production using MOCVD tools.


Lucht said the GPT group is committed to


Page 1  |  Page 2  |  Page 3  |  Page 4  |  Page 5  |  Page 6  |  Page 7  |  Page 8  |  Page 9  |  Page 10  |  Page 11  |  Page 12  |  Page 13  |  Page 14  |  Page 15  |  Page 16  |  Page 17  |  Page 18  |  Page 19  |  Page 20  |  Page 21  |  Page 22  |  Page 23  |  Page 24  |  Page 25  |  Page 26  |  Page 27  |  Page 28  |  Page 29  |  Page 30  |  Page 31  |  Page 32  |  Page 33  |  Page 34  |  Page 35  |  Page 36  |  Page 37  |  Page 38  |  Page 39  |  Page 40  |  Page 41  |  Page 42  |  Page 43  |  Page 44  |  Page 45  |  Page 46  |  Page 47  |  Page 48  |  Page 49  |  Page 50  |  Page 51  |  Page 52  |  Page 53  |  Page 54  |  Page 55  |  Page 56  |  Page 57  |  Page 58  |  Page 59  |  Page 60  |  Page 61  |  Page 62  |  Page 63  |  Page 64  |  Page 65  |  Page 66  |  Page 67  |  Page 68  |  Page 69  |  Page 70  |  Page 71  |  Page 72  |  Page 73  |  Page 74  |  Page 75  |  Page 76  |  Page 77  |  Page 78  |  Page 79  |  Page 80  |  Page 81  |  Page 82  |  Page 83  |  Page 84  |  Page 85  |  Page 86  |  Page 87  |  Page 88  |  Page 89  |  Page 90  |  Page 91  |  Page 92  |  Page 93  |  Page 94  |  Page 95  |  Page 96  |  Page 97  |  Page 98  |  Page 99  |  Page 100  |  Page 101  |  Page 102  |  Page 103  |  Page 104  |  Page 105  |  Page 106  |  Page 107  |  Page 108  |  Page 109  |  Page 110  |  Page 111  |  Page 112  |  Page 113  |  Page 114  |  Page 115  |  Page 116  |  Page 117  |  Page 118  |  Page 119  |  Page 120  |  Page 121  |  Page 122  |  Page 123  |  Page 124  |  Page 125  |  Page 126  |  Page 127  |  Page 128  |  Page 129  |  Page 130  |  Page 131  |  Page 132  |  Page 133  |  Page 134  |  Page 135  |  Page 136  |  Page 137  |  Page 138  |  Page 139  |  Page 140  |  Page 141  |  Page 142  |  Page 143  |  Page 144  |  Page 145  |  Page 146  |  Page 147  |  Page 148  |  Page 149  |  Page 150  |  Page 151  |  Page 152  |  Page 153  |  Page 154  |  Page 155  |  Page 156  |  Page 157  |  Page 158  |  Page 159  |  Page 160  |  Page 161  |  Page 162  |  Page 163  |  Page 164  |  Page 165  |  Page 166  |  Page 167  |  Page 168  |  Page 169  |  Page 170  |  Page 171  |  Page 172  |  Page 173  |  Page 174  |  Page 175  |  Page 176  |  Page 177  |  Page 178  |  Page 179  |  Page 180  |  Page 181  |  Page 182  |  Page 183  |  Page 184  |  Page 185  |  Page 186  |  Page 187  |  Page 188  |  Page 189  |  Page 190  |  Page 191  |  Page 192  |  Page 193  |  Page 194  |  Page 195  |  Page 196  |  Page 197  |  Page 198  |  Page 199  |  Page 200  |  Page 201  |  Page 202  |  Page 203  |  Page 204  |  Page 205  |  Page 206  |  Page 207  |  Page 208  |  Page 209  |  Page 210  |  Page 211  |  Page 212  |  Page 213  |  Page 214  |  Page 215  |  Page 216  |  Page 217  |  Page 218  |  Page 219  |  Page 220  |  Page 221  |  Page 222  |  Page 223  |  Page 224  |  Page 225  |  Page 226  |  Page 227  |  Page 228  |  Page 229  |  Page 230  |  Page 231  |  Page 232  |  Page 233  |  Page 234  |  Page 235  |  Page 236  |  Page 237  |  Page 238  |  Page 239  |  Page 240  |  Page 241  |  Page 242  |  Page 243  |  Page 244  |  Page 245  |  Page 246  |  Page 247  |  Page 248  |  Page 249  |  Page 250  |  Page 251  |  Page 252  |  Page 253  |  Page 254  |  Page 255