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strategy validates a new approach to engineering optoelectronic devices with dramatically improved computational power.
The second paper, entitled “Spectroscopic signatures of many-body interactions and delocalized states in self-assembled lateral quantum dot molecules,” describes a different molecular design, in which the two quantum dots are placed side by side instead of one on top of the other. The lateral geometry changes the way in which electrons are trapped in the molecule and creates more complex electronic molecular states.
These new electronic states of the lateral molecular design provide a template for new computing architectures that overcome scaling limits of conventional charge-based computing by mediating interactions between single confined spins.
Doty’s work with quantum dot molecules is supported, in part, through funding from the National Science Foundation, which awarded him the prestigious Faculty Early Career Development Award in 2009. The highly competitive NSF Career Award is bestowed on researchers deemed most likely to become the academic leaders of the 21st century.
Doty, who joined the UD faculty in 2007, previously served as a National Research Council research associate at the Naval Research Laboratory after earning his bachelor’s degree in physics from Pennsylvania State University and his doctoral degree in physics at the University of California, Santa Barbara.
EuroPIC announces session on photonic integration platforms
Integration of multiple optical functionalities on a single chip is now a principal direction for industry growth and development in optics and photonics.
The EuroPIC project has today launched a call for presentations on optical integration platforms at a special session of the European Conference on Integrated Optics to be held in Barcelona, Spain: 18-20 April 2012.
Integration platforms, involving design, simulation, and manufacture using a foundry approach, are a cost-effective pathway to photonic chips with increased functionality and performance, often specific to a particular application. Such platforms are currently being developed for Silicon (
www.helios-project.eu) and Indium Phosphide (
www.europic.org), and there is interest in the development of a platform for Gallium Arsenide based circuits, as well.
Of particular interest in this session are presentations on:
1. 2.
Beyond the state-of-the-art results
Prospects for the combination of both Silicon and Compound semiconductors on the same platform 3.
Software tools for integrated design, simulation of processing and performance.
Proposal for participation in this session is a one- step process. Prospective authors should indicate their preference to make a presentation in the Integration Platform Session by noting this after the presentation title in their submission. All the details for submission are given on the conference site:
www.ecio2012.com/paper-submission. The deadline for submissions is 2 February 2012.
About EuroPIC: EuroPIC is a consortium of experts including Europe’s key players, consisting of a mix of SMEs, industry and academic partners, in the fields of component manufacturing, PIC design and applications, photonic CAD, and packaging. It facilitates access to fabrication of advanced but very cost effective Photonic Integrated circuits. (
www.europic.org)
About EPIC: With 80 voting members and over 400 associate members, EPIC is Europe’s leading photonics industry association. EPIC promotes sustainable development for European organisations working in photonics. Working together, EPIC members have played a leading role in creating and operating the European Technology Platform, Photonics-21, as well as many influential European projects, such as LIFT for fibre laser development, and Nexpresso which supports commercial innovation by SMEs. (www.epic-assoc. com)
November/December 2011
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