Telecoms ♦ news digest ship on a sample basis beginning January 10, 2012.
Philip Smallwood to present at CS Europe Conference 2012
The Lighting Market Analyst at IMS Research will give a presentation on “The Market for LEDs in Lighting”.
Following the success of CS Europe 2011, next year’s conference is expanding to 2 days and offers a fantastic mix/quality of speakers making it the must attend industry event for 2012.
Left: MGFC50G5867 Right: MGFC47G5867
GaAs amplifiers have been commonly employed in microwave power transmitters. In recent years, however, GaN amplifiers have become increasingly popular due to their high breakdown-voltage and power density, high saturated electron speed and ability to contribute to power saving and the downsizing of power transmitter equipment.
Mitsubishi Electric first began sample shipments of high-output GaN HEMT amplifiers for C-band space application in March 2010.
With more than 43% of power added efficiency, the modules feature 40V high-voltage operation. The internally impedance-matched devices have a low distortion with an output power meeting 3rd-order Inter Modulation (IM3) of -25dBc of 46dBm.
Other Features
Register at
www.cseurope.net & book your delegate place now as numbers will be limited. The conference takes place on 12th/13th March 2012 at Hilton Hotel, Frankfurt, Germany.
A networking dinner will also be held the night of the 12th March.
Conference Chair Dr Andrew W Nelson, President & CEO, IQE Markets and III-V CMOS - Morning 12th March
A mix of insightful market research presentations & cutting-edge research destined to shape tomorrow’s compound semiconductor industry.
Presentations will include:
Compound Semiconductor Markets: Current Status and Future Prospects - Asif Anwar, Director – Strategic Technologies Practice, Strategy Analytics
The Market for LEDs in Lighting - Mr. Philip Smallwood, Lighting Market Analyst, IMS Research
Wide Bandgap device market update - Dr. Philippe ROUSSEL, Senior Project Manager, Yole Développement
European efforts to develop III-Vs on 200 and 300 mm silicon - Dr. Matty Caymax, Chief Scientist, Imec
An Overview of the DARPA Diverse Accessible Heterogeneous Integration (DAHI) Program - Sanjay Raman, Program Manager, Defense
November/December 2011
www.compoundsemiconductor.net 105
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