October, 2021
www.us-tech.com
ULM, GERMANY — TRUMPF has launched a new VCSEL plat- form with monolithically integrat- ed micro-optical elements. 3D sensing applications benefit from tailored illumination profiles from smart glasses and face recognition. This revolutionary VCSEL
array technology supports a new generation of illumination de- vices that are inherently eye-safe over the whole product lifetime as the diffuser optics are mono- lithically incorporated into the laser array. This allows easy in- terfacing with the new platform and enhances reliability. Also, the form factor is sig-
nificantly reduced compared to present hybrid VCSEL package solutions. ViBO can be directly SMD mounted onto a board or driver IC without additional wire
Saki’s 3Si SPI and 3Di AOI are IPC/CFX
Certified FREMONT, CA — Saki Corpora- tion, an innovator in the field of automated optical and X-ray in- spection equipment, announces that the 3Si Solder Paste Inspec- tion (SPI) and 3Di Automated Optical Inspection (AOI) solu- tions have been certified by the IPC as IPC-CFX compliant. Saki’s certification for IPC-
CFX (Connected Factory Ex- change), a global standard to simplify and standardize M2M (machine-to-machine) and ma- chine-to-MES communication, provides customers with a high level of reliability when in- stalling Saki’s inspection ma- chines in the future. The system enables effective data communi- cation between devices in a facto- ry line, improving the efficiency and visibility of the entire line, and reducing costs. Saki’s 3Si and 3Di series so-
lutions are capable of high-speed precision measurement and in- spection using proprietary hard- ware and software technologies and enable M2M connection with solder printers and pick-and- place machines. With the addi- tion of Saki to the IPC-CFX QPL (Qualified Products List), Saki’s M2M capability now offers a Smart Factory solution that can be connected to other IPC-CFX compatible devices in the factory, contributing to the improvement of product quality and productiv-
ity of the entire line. Contact: Saki America, Inc.,
48016 Fremont Boulevard, Fre- mont, CA 94538 % 510-623-7254 E-mail:
sales.us@
sakicorp.com Web:
www.sakicorp.com
See at productronica A2.259
shown: PulseForge Soldering Batch also available in PulseForge Soldering In-Line
See at productronica, B1.650 PulseForge® The Future of Soldering
bonding. This supports for in- stance easier integration under smartphone displays. In the first generation prod-
ucts, TRUMPF focuses on the re- alization of illumination devices incorporating various diffuser designs for a wide range of emis- sion angles to support various flood illumination applications for consumer and automotive. With coplanar contact de-
signs, the devices can be flip-chip mounted yielding the most com- pact integration with the short- est electrical path and thus min- imum electrical inductance. This
ViBO VCSEL platform.
design setup allows short pulses, high modulation speed and the flexibility of addressing multiple channels or even selected seg-
Page 37 TRUMPF presents new VCSEL Laser Platform
ments on the chip. iBO lays the foundation of a
new platform which can be tai- lored to various customer re- quirements and optical system designs. Conceivable fields of ap- plication could be all areas of proximity sensing — from smart glasses over face recognition to-
wards LiDAR applications. Contact: TRUMPF Photonic
Components GmbH, Lise-Meit- ner-Strasse 13, 89081 Ulm, Ger- many % +49-151-12-66-62-39 Web:
www.trumpf.com
See at The ASSEMBLY Show Booth 941
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