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June, 2017
Technic Develops Palladium Electroplating Process
Cranston, RI — Technic has released its Pallaspeed® 990, a pure palladi- um electroplating process for high- volume electronic applications. The process produces a high-ductility, low-stress, bright deposit with no micro-cracking in thicknesses of up to 4 µm. The process has a neutral pH with no smell of ammonia and offers a wide current density range with a stable electrolyte. A key characteristic of the
process is that it uses a minimal amount of hydrogen during plating, which eliminates cracking of the deposit. Pallaspeed 990 is a fully ana- lyzable process with simple UV/VIS procedures for additive control. The process is stable, with more than a five metal turnover (MTO) bath life. The process also offers superior
without leaving your facility or laboratory
Convenient X-ray demos of your product
corrosion resistance, and with the high ductility of the deposit, the
process is a good choice for mobile phone quick-charge connectors and other applications where regular
Pallaspeed 990 palladium-plated metal parts.
manual connectivity is required. Contact: Technic, Inc., 47 Molter
Street, Cranston, RI 02910 % 401-781-6100 E-mail:
info@technic.com Web:
www.technic.com
Using Reverse Engineering... Continued from page 63
tract manufacturers, one that usual- ly requires considerable investment in capital equipment for assembly and inspection.
www.glenbrooktech.com
Fully-wireless interfaces. The need for fully-wireless interfaces is attracting the attention of the smart- phone industry. Most wearables already include this technology. When water- and dust-proofing a device, connectors are always the main weak points of the design. Thus, eliminat- ing connectors altogether is further incentivized by the need to fully seal the devices. It is surprising that the new
iPhone doesn’t have a wireless charg- er, especially when most high-end Android devices already do. But, Apple did catch users off guard by removing the audio jack. This could be the first step in the company’s strategy toward a fully-wireless architecture for the iPhone. In the future, all battery charg-
ing and communication will be done wirelessly, thus removing the need to build any connectors into the device. This will further impact the water resistance or proofing rating of the next generation of iPhones. It will also allow Apple to continue creating even thinner devices. We may see such a revolutionary model as early as this year, when the company is said to unveil a groundbreaking device for the smartphone’s 10th anniversary.
Camera technology is improving. The new iPhone 7 Plus contains two 12 MP cameras — one wide-angle camera with optical image stabiliza- tion (OIS) and a telephoto lens, allowing for optical zoom. This multi- ple camera trend will continue, as improvements in software and image processing enable companies to leverage different lens modalities for more advanced products. Contract manufacturers ready to take on chal- lenging mechanical assembly jobs will likely benefit.
See at ATX / MD&M East, Booth 832
Memory.The development of ever- increasing memory will also contin- ue. Although major OEMs are exert- ing pressure to move data to cloud services, local storage is still a grow- ing necessity. Some of this need has been driven by a steady improve- ment in camera resolution, which
continues to require increasing levels of data storage. Tearing down popular con-
sumer electronics is an excellent way to gain some insight into how large companies develop their products. The major forces in SMT manufac- turing will continue pushing U.S. manufacturers toward miniaturiza- tion. The number of WLCSP devices in major products continues to grow, which tells us they are on their way to becoming a standard. The impact of this transforma-
tion may not be instantaneous. Though, even small or mid-size con- tract manufacturers in the U.S., will certainly be impacted. Even though their customers may not be design-
Dual 12 MP cameras from the iPhone 7 Plus.
ing products with WLCSP, they will soon lose that option, as the large volume players in the market — the ones the component manufacturers cater to — will demand WLCSP. This is a continuous process, similar to what happened to through-hole com- ponents. Even today, we still come across manufacturing companies that are migrating to surface mount technology. Progress is inevitable. Contact: Creative Electron, Inc.,
253 Pawnee Street, San Marcos, CA 92078 % 760-752-1192 fax: 760-752-1196 E-mail:
info@creativeelectron.com Web:
www.creativeelectron.com r
Additional authors who contributed to this article include Andrew Gedker, Tom Geib, Griffin Lemaster, David Phillips, Jesse Squire, Dr. Glen Thomas, Jerry Torres, and Carlos Valenzuela of Creative Electron, Inc., and Andrew Goldberg, Samantha Lionheart, Brittany McCrigler, and Jeff Suovanen of ifixit.
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