June, 2017
www.us-tech.com Solder for Sensitive Components Continued from previous page
of the measuring sensor at higher accelerations. Shocks in the y- and z-axes were to the full 30g. For comparison, 10g is equal to roughly four times the shock that a cellphone experiences when dropped 1m (3.3 ft) onto a concrete floor. The vibration test started with a resonance
frequency search on the electronic device in all three axes. The resonance frequency of a device is the frequency at which it experiences the highest vibratory forces. This is not only different for each device, but also for each axis. After determining the resonance frequencies, a two-hour vibration endurance test, with a peak acceleration of 3g, was to be performed. If no resonance frequency was able to be determined, a standardized 30 Hz was used with a peak acceleration of 3g. In this case, only the x-axis was found to have a clear resonance frequency of about 83 Hz. After the shock and vibration
testing, the units soldered with the LMPA-Q alloy were visually inspect- ed. None of the units showed signs of failures or misalignments. The units were then sent to Megger Instruments
well at peak accelerations of 18, 20, 21, and 22g. It wasn’t until the fifth and final sequence, with a frequency of 50 Hz and an acceleration of 25g, that the SAC 305 alloy failed. The LMPA-Q alloy allows for a reduction in
soldering temperatures, sparing sensitive compo- nents and substrate materials damage during pro- cessing. Interflux’s LMPA-Q alloy performed well for Megger’s handheld measuring device, resulting in the company’s adoption of the alloy for other processes and products. Along with boosting solder joint strength, Interflux has made lowering the temperature of lead-free solder during reflow a viable option. Contact: Interflux N.V., Eddastraat 51, 9042
A component lifts off the board after solder joint failure.
Gent, Belgium % +32-9251-4959 fax: +32-9251-9636 E-mail:
info@interflux.com Web:
www.interflux.com r
Page 55
Twelve identical devices undergo vibration testing.
for in-circuit and functional testing; all units passed.
Comparative Testing From these demanding tests, it
was shown that Interflux’s LMPA-Q low melting point solder alloy could withstand mechanical stress and had sufficient strength to be used in Megger’s handheld devices. Once satisfied that the new
alloy could withstand the rigors of handheld devices, the company when a step farther and began comparative vibration endurance tests with the LMPA-Q solder alloy and an SAC 305 solder alloy. Comparative shock test-
Along with boosting solder joint strength, Interflux has made lowering the temperature of lead-free solder during reflow a viable option.
ing is more difficult, due to test setup limitations. Shock and vibration resistance tend to go hand-in-hand as vibratory force is made up of a rapid sequence of shocks. As vibration in the x-axis was
expected to be a more common, it was judged to be more critical and was the only axis used for the comparative testing. A standard test frequency of 30 Hz, in combination with a peak acceleration of 18g was used as the initial setting for a 30-minute en - durance test. After a thorough visual inspection, the acceleration or the fre- quency was increased gradually, until the first failure was discovered. After five test sequences, four of
which were at 30 Hz, the LMPA-Q and SAC 305 alloys both performed
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