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Partnering June, 2017


Filling the Retirement Gap Through Hands-On Training By Mike Prestoy, Senior Manufacturing Engineer, ACI Technologies


fective, targeted training is a solid solution to this problem, which helps to fill this growing knowledge gap. Production equipment comes with instructions, but not with the experi- ence that skilled engineers, man- agers and technicians have built up over many years. ACI Technologies is combat-


T


ing this issue by offering equip- ment-based training, electronics failure analysis and prototype de- velopment services. The compa- ny’s programs have a simple di- rective to “exceed customer expec- tations” in all training programs. Early on, the company realized that the retention and compre- hension of manufacturing knowl- edge is strengthened by hands-on involvement with the equipment.


Practical Training Courses ACI has two complete SMT


production lines, two different X- ray machines, two different BGA rework systems, die attach and wirebond equipment, selective soldering equipment, and clean- ing equipment — both batch and


here are more talented engi- neers retiring than there are personnel to replace them. Ef-


in-line. The company’s in-depth train-


ing presents the performance capa- bilities and limitations of each ma- chine. Every process is carefully discussed, along with troubleshoot- ing strategies for when things go wrong. Class attendees program the machines themselves and each individual assembles his or her own circuit board. ACI also recognizes that when


companies are in need of training, the need is often focused on a spe- cific production issue. A targeted program costs less money, takes less time and meets each compa- ny’s particular need more accu- rately than a broad-based pro- gram. ACI has crafted a series of specific, targeted and skills-based courses, such as BGA inspection and rework, design for manufac- turability and solder school. Many companies prefer to


have training at their own plants, so almost all courses can be of- fered at the customer’s facility. A prime example is the one-day sol- der school. To keep costs down, many manufacturers hire inexpe- rienced employees, planning to train them later. This results in


MICROLINE 5000 Flex Drilling and Cutting


very uneven performance. ACI of- fers its one-day solder school at the customer’s plant, saving the customer both time and money. Proper profiling of the reflow


oven requires a state-of-the-art profiler, knowledge of heat trans- fer and solder pastes, as well as a familiarity with the characteris- tics of various ovens. ACI’s course in solder reflow and profiling is split between lecture and hands- on demonstration. The attendees quickly learn how to configure the oven to achieve good solder joints with lead or lead-free solders. Relevant training requires


modern equipment. ACI Technolo- gies operates the EMPF, which is the U.S. Navy’s National Center of Excellence dedicated to advanced electronics manufacturing. The fa- cility is essentially a stationary equipment demonstration center, open free to the manufacturing community where a high-mix Es- semtec SMT line can demonstrate jet dispensing, while a Samsung high-speed 28,000 CPH placer, with an ITW/EAE Speedline sten- cil printer, a BTU oven, and a Nikon X-ray system address the mid- and high-volume markets.


Failure Analysis E-Book Besides teaching the basics


of building electronic products, ACI also provides services to iden- tify the root causes of problems. With decades of accumulated ex- perience, ACI has conducted thou- sands of failure analysis investi- gations. The company constantly re-


ceives requests for books or web- sites that can provide some guid- ance on the various equipment and processes used to uncover the root cause of a specific issue. In response, ACI has published an e- book entitled Failure Analysis Techniques for Electronics. This informative book is available at no cost from the company’s web- site (http://store.aciusa.org/fail- ure-techniques-for-electronics- digital-download-p181.aspx). The book covers the most use-


The MicroLine 5000 is the flex PCB industry answer to high through-put, high-yield drilling applications. With the ability to drill holes down to 20µm, a variety of both organic and inorganic substrates can be processed, such as:


 Flexible PCBs  IC Substrates


 High Density Interconnect PCBs


1-800-345-5753 | www.lpkfusa.com/flexdrilling


ful techniques used by the compa- ny and those in general use today. These include identifying root cause failures of components, cir- cuit boards and die failure, as well as techniques of solderability test- ing, including steam aging, wet- ting balance and SERA. X-ray analysis and voiding


calculations of solder joints are critical when dealing with BGAs. Without X-ray analysis, both in the production line and rework, the quality of the solder joint can never be clearly determined. With smaller parts and less


circuit board real estate, cleanli- ness assessments are now critical for reliability, including bulk ion- ics and ionograph testing. The book also discusses scanning elec-


Free failure analysis e-book, available at ACI’s website.


Philadelphia International Air- port. The company’s competitive advantage comes from its experi- enced, technical staff that sup- ports its manufacturing services. A wide range of technical expert- ise is available on-demand to sup- port client needs and specifica- tions, not just a menu of off-the- shelf services. The company’s demonstration


floor is always open for equipment and technology presentations. En- gineers, university students, man- ufacturers, and technicians are regular visitors, along with U.S. army and navy personnel. The facility also frequently


hosts meetings of the Surface Mount Technology Association (SMTA). These regular meetings present the local electronics com- munity with the latest equipment and processes in manufacturing. ACI leverages years of expe-


rience in electronics manufactur- ing and passes this expertise on to those with a desire to learn. Through its educational services, the company hopes to equip and inspire the next generation to lead the electronics community in the years to come. Contact: ACI Technologies, Inc.,


One International Plaza, Suite 600, Philadelphia, PA 19113 % 610-362-1320 fax: 610-362-1289 E-mail: info@aciusa.org Web: www.aciusa.org r


tron microscopy, which can reveal tin whiskers and counterfeit com- ponents.


BGAs are the most common


component that carry the process- ing tacks in today’s assemblies, and require special skills. The book presents case studies with careful analysis and photographs of head-in-pillow defects and sol- der voiding. ACI occupies over 36,000 ft2


of office, manufacturing and labo- ratory space in a contemporary of- fice campus adjacent to the


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