June, 2017
www.us-tech.com
Using Reverse Engineering... Continued from page 60
ber of moving parts in the assembly. In place of the missing audio
jack is a new plastic component. According to Apple, the plastic part is a barometric vent. With the added ingress protection of the watertight seal, the iPhone uses this baffle to equalize the internal and atmospher- ic pressures, creating an accurate altimeter.
Repairability The ability to rework smart-
phones and wearables is critical to the subsistence of a growing number of companies that fix these devices. The iPhone 7 Plus is a complex de - vice with thousands of parts. Dis - assembling it is a complicated pro - cess. These phones are expensive devices that can be damaged easily by a single drop on the floor. The repair market is a $4 billion
worldwide industry dedicated to put- ting these devices back into commis- sion. The focus of these companies is on the repair and replacement of dis- plays and screens, batteries, buttons, headphone jacks (no longer an issue in the iPhone 7), cameras and sensors. Since 2010, iPhones have been
relatively easy to repair. This is main- ly due to the fact that the first thing to remove is the screen, because the screen is usually what needs to be replaced. Once the screen is removed, the battery is also easily accessible. Samsung phones, on the other
hand, are becoming much more diffi- cult to repair. The Galaxy S3 was assembled with an easy-to-remove battery. The display was somewhat challenging, but it could be done. However, the company’s new S7 was built with very tight tolerances that make it difficult to rework. The display needs to be
removed (and likely destroyed) if the USB port is to be replaced. Front and rear glass makes for twice the risk of cracking, and strong adhesive on the rear glass makes it very difficult to open the device. Replacing the glass without destroying the display is basically impossible.
Rapid Electronic Future Trends
Waterproofing is a major trend driving the electronic design and manufacturing of most wearables and smartphones today. The iPhone 7, for example, has an IP67 rating. However, it is not waterproof. The distinction is significant, from both a user experience and manufacturabil- ity perspective. The technologies associated with waterproofing elec- tronics, such as conformal coating design, application and inspection, will continue to be the focus of future manufacturing R&D.
Batteries still take up at least 50 percent of the space inside all of today’s wearables and smartphones.
For this reason, a great deal of research is focused on increasing the power density of batteries. A smaller battery directly impacts the number of features, and sensors, that can be
Page 63
wireless charging in 2015 with the first edition of the Apple Watch. Although wireless charging has gained mainstream status with other major OEMs, such as Microsoft, Samsung, Sony, and Lenovo, it is still missing from the iPhone. The Apple Watch has one of the
Apple Watch 2 after complete teardown.
included in a device. We are likely to see supercapacitors make their debut in the world of smart devices in the next 5 years.
Wireless charging. Apple debuted
most dense electronic packages we have encountered in our teardowns. The system in package unit (SiP) (S1 in the first edition, and S2 for the second) is almost fully assembled using WLCSP. WLCSP is one of the highest-density packaging technolo- gies available. The package does not exceed the size of the bare die by more than 20 percent and solder ball pitch is no greater than 1 mm (0.04 in.). Handling and assembling these devices is a challenge for SMT con- Continued on page 68
Full Flexibility with Ersa VERSAFLEX!
Assembly Continued from previous page
hours and available on day two. Even with poor mismatched assembly soft- ware, machine programs can be com- pleted in 24 hours as well. Therefore, the assembly process can be completed on day three, meeting our initial defi- nition of RPT. For more complex assemblies
with multilayer PCBs and high-tech options, obtaining the PCB becomes the pacing item for the assembly time. Matching the technology to the capability and equipment of the fab shop is an essential element in guar- anteeing that the PCBs will pass lab- oratory evaluation before compo- nents are committed to assembly. Someday soon, we hope to see
high-tech PCBs created with inkjet technology. In that event, even high- technology assemblies can meet RPT requirements. Contact: RapidProto, 8116
Zionsville Road, Indianapolis, IN 46268 % 317-975-2060 fax: 317-663- 0729 Web:
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