June, 2017
www.us-tech.com
Cambridge, MA — The further miniaturiza- tion of electronic devices and higher levels of integration require new approaches to PCB manufacturing. Cicor’s DenciTec technology is a solution that offers flexible interconnec- tion options without impacting reliability. Standard PCB technologies include
panel and pattern plating. With both meth- ods, concessions must be made when manu- facturing line widths and spaces less than 35 µm, in order to achieve acceptable results and throughput. Today’s production process- es do not fully utilize modern PCB technolo- gy, such as via stacking or via-in-pad struc- tures.
The classic semi-additive processes of
thin-film manufacturers allow the production of structures with line widths and spaces of less than 15 µm, but only with small-sized
Techcon: High Throughput Dispense Pump
Cypress, CA — Techcon Systems, a product group of OK International, has launched a new positive dis- placement PC pump, the TS8100- 200. The pump series is planned to have many configurations. The com- pany launched its smallest configu- ration, the TS8100-100, in October 2016. The new version has been designed for higher output. The pump offers high throughput
and tight dispensing output reliabili- ty. It can dispense 3.38 ml/minute with a repeatability of ±1 percent.
DenciTec enables the production of reliable, high-density circuits.
Page 67 Cicor DenciTec Creates High-Density Interconnects
panels. As a result, the cost of the individual cir- cuits is significantly higher than for that of print- ed circuit boards. DenciTec enables the production of circuits
with extremely high density. Miniaturization is possible at many levels: line widths and spaces down to 25 µm with copper thicknesses of 20 µm in all layers, laser via diameter of 35 µm, annular rings of 30 µm for outer layers and 20 µm for inner layers, and copper-filled blind vias with the possi- bility of via stacking and via-in-pad. Even ultra- thin circuits can be made by using 12.5 µm poly-
imide material. Contact: Cicor Americas, Inc., 185 Alewife
Brook Parkway, Suite 410, Cambridge, MA 02138 % 617-576-2005 E-mail:
info-americas@cicor.com
Web:
www.cicor.com See at ATX/MD&M East, Booth 2174
TS8100-200 positive displacement PC pump.
The TS8100 series positive dis-
placement pump is designed to dis- pense a wide range of fluids, from low-viscosity coatings to high-viscosi- ty greases. Typical applications include underfilling PCBA compo- nents, potting and encapsulation applications, applying lubrication to automotive parts, and dispensing pastes and fluxes. The PC pump uses a specially
designed stator and rotor to provide consistent dispensing output. The TS8100 comes standard with a syringe bracket, mounting bracket kit, luer lock fitting, cleaning kit, and
dispensing tip selection pack. Contact: Techcon Systems,
10800 Valley View Street, Cypress, CA 90630 % 714-230-2398 fax: 714-828-2001 E-mail:
jsimmons@okinternational.com Web:
www.techcon.com
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