June, 2017


www.us-tech.com


Saki Develops Advanced Component Detection


Fremont, CA — Saki Corporation has added a new extra component detec- tion (ECD) feature to its range of AOI systems. The new algorithm inspects for stray components, solder balls


and accurately reconstruct the fillet geometry of the image. With newly developed four-way


side cameras, the system accurately detects J-leads, QFN packages and


P PROBLEM


Page 31


FAILED SOLDER JOINT


Saki ECD detects stray components and materials.


and foreign materials across the en- tire surface of the circuit board. It can detect objects less than 200 µm in size. ECD, coupled with the benefits


of the complete scan of the PCB by the company’s line scan technology, pro- vides further assurance of product quality. Saki’s ECD is incorporated into both its 2D and 3D AOI systems. Saki’s systems handle all types


of boards, including extra-large PCBs. The company’s BF-3Di series uses multi-phase ring lighting and proprietary coaxial top-light illumi- nation to measure the solder height


connector assemblies with four-way projection technology. These systems measure heights from 0 to 20 mm (0 to 0.8 in.) with 1 µm resolution and achieve full automation with very low false calls and zero escapes. In addition, the company’s BF-3Di soft- ware can reduce library creation time by over 50 percent when com- pared with conventional AOI ma- chines.


Contact: Saki America, Inc.,


48016 Fremont Boulevard, Fremont, CA 94538 % 510-623-7254 E-mail: sales.us@sakicorp.com Web: www.sakicorp.com


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