December, 2016


www.us- tech.com


New Bedford, MA — Cornell Dubilier Electronics has introduced the latest in its series of Flatpack ruggedized flat aluminum electrolytic capacitors, the MLSG. The series of products targets compact power supply applications in military and aero- space, as well as other critical systems. Design en- hancements and a new electrolyte push the MLSG to nearly double the operating life of its predecessor, at no added cost. Two principal package profiles are offered in this technology, the MLSG Flatpack, which measures 0.5 in. (1.3 cm) thick and 1.75 in. (4.5 cm) wide, and the MLSG Slimpack, measuring 0.5 in. (1.3 cm) thick by 1.0 in. (2.5 cm) wide, both offered in length increments of, 1.5, 2.0, 2.5, and 3.0 in. (3.8, 5.0, 6.3, and 7.6 cm). MLSG Flatpack capacitors can


be made to withstand up to 50g vi- brations (10g standard) and operate at altitudes greater than 80,000 ft (24.4 km). With stainless steel cases and near-hermetic welded seals, they are built for extended duty in harsh conditions and a high level of per- formance is maintained over the full operating temperature range. Capac- itance retention at –55°C (–67°F) is very strong, with excellent high tem- perature performance up to +125°C (+257°F). The new electrolyte system is fully REACH-compliant, allowing the components to be used in a broad range of applications where space ef- ficiency and long life are required. A wide range of standard capac-


itance values from 220 to 24,000 µF are available, with voltage ratings up to 250 VDC. The flat package design does more than save space; it is easi-


EMS: Dam and Fill Chip Encapsulants


Delaware, OH — Engineered Materi- als Systems has introduced its 640- 35 (dam) and 640-46 (fill) dam and fill, UV-cured chip encapsulants for chip-on-board smart card applica- tions. The new materials are de- signed to protect wirebonds and to reduce the stresses associated with thermal cycling. The materials have been engineered to withstand circuit board reliability test criteria.


CDE Intros Flat Aluminum Electrolytic Capacitors


Flat electrolytic capacitors.


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ly cooled, and can offer the flexibility of ganging two or more capacitors in ways that conventional electrolytic devices cannot. Device options include high-vibration (HV) to


withstand up to 50g and high-reliability (HR), with burn-in at rated voltage and 85°C (185°F). Where a true glass-to-metal hermetic seal is required, CDE offers the MLSH Slimpack, which is similar- ly constructed in a flat stainless steel package. It is available in nine values, from 120 to 3,200 µF,


with ratings up to 250 VDC. Contact: Cornell Dubilier Electronics, Inc.,


140 Technology Place, Liberty, SC 29657 % 864-843-2626 fax: 864-843-2402


E-mail: mdipietro@cde.com Web: www.cde.com


Dam and fill encapsulants for smart card assembly.


The chip encapsulants cure rap-


idly when exposed to intense UV light and have been developed for en- capsulating the small chips in smart card applications where fast process- ing is required. The two materials are the latest additions to the compa- ny’s extensive line of electronic mate- rials for semiconductor, circuit as- sembly, photovoltaic, printer head, camera module, disk drive, and pho-


tonic applications. Contact: Engineered Materials


Systems, Inc., 100 Innovation Court,


Delaware, OH 43015 % 740-362-4444 fax: 740-362-4433 Web: www.emsadhesives.com


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