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www.us- tech.com The material matters in material handling


December, 2016


X-FAB Deploys High Temperature Implanter


 


Exceeds ANSI/ESD standards for ESD protection Working range of –60° to 250° F Permanent ESD properties over life of product High load-bearing capacity


Reinforced composites bring a whole new level of performance to electronics assembly. And the leading name in FRP is MFG. Call us toll-free at (800) 458-6050.


Learn more about Fibrestat at www.mfgtray.com.


 


Lubbock, TX — X-FAB Silicon Foundries has reached a milestone in its establishment of a semiconductor foundry that supports 6 in. (152 mm) silicon carbide (SiC) wafer produc- tion. The company, in collab- oration with the U.S. De- partment of Energy (DoE) and the PowerAmerica In- stitute, has deployed a high temperature implanter at its facility in Lubbock, TX. Leveraging its existing,


high-volume silicon produc- tion lines, the company can offer the economies of scale needed to encourage wide- spread adoption of power de- vices based on SiC sub- strates. As a result it is fully-


equipped to present the in- dustry with responsive, market scalable and cost-ef- fective manufacturing capa- bilities. X-FAB’s SiC offering also draws on the company’s reputation for tackling challenging applications. It has been predicted that the automotive and industrial sectors are going to be responsible for driving SiC uptake, and the company is focused on providing key technolo- gies for these areas. With the installation and quali-


fication of the high temperature im- planter, the company is now ready to support its SiC customers as they move from prototyping to volume production in 2017. X-FAB is an analog, mixed-sig- nal and MEMS foundry group that


manufactures silicon wafers for auto- motive, industrial, consumer, med- ical and other applications. The com- pany offers a commitment to quality standards, manufacturing excellence


Silicon carbide wafer.


and innovative solutions by using modular CMOS processes in geome- tries ranging from 0.13-1.0 µm and special BCD, SOI and MEMS processes. The company’s mixed-sig- nal ICs, sensors and MEMS are man- ufactured at six production facilities across Germany, France, Malaysia,


and the U.S. Contact: X-FAB, Inc., 2301 N


University Avenue, Lubbock, TX 79415 % 806-747-4400 fax: 806-747-3111 E-mail: info@xfab.com Web: www.xfab.com


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