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www.us- tech.com


December, 2016


Digicom Adds Nitrogen to Soldering and Reflow


Oakland, CA — EMS provider Digi- com Electronics is now generating its own nitrogen to use in its hand, se- lective and reflow soldering process- es to strengthen bonds and to im- prove solder adhesion. Adding nitro- gen minimizes device failure and provides higher levels of PCB integri- ty, especially in mission-critical prod-


THE ENABLING TECHNOLOGY FOR INDUSTRY 4.0


oxidation at critical moments during the soldering operation. Digicom Electronics offers ad-


vanced electronics manufacturing with quality that fits the needs of larger enterprises while at the same time providing the benefits and indi- vidual attention needed to serve start-up companies. The company


Soldering system using nitrogen during reflow.


ucts for the medical, military, aero- space, and RF wireless industries. Many major product failures re-


cogiscan.com


sult from a weakness in the solder joint that connects the wire bond to the PCB or the solder connecting the device or package to the board. Nar- row pitch processes seem to benefit the most and the company cites studies that show a 50-60 percent reduction in defects when using nitrogen in the re- flow process. The nitrogen is generat- ed and piped directly to machine in- puts and work areas at a prescribed volume and pressure to achieve satu- ration of the inert gas and to eliminate


collaborates with its customers from design to the final, fully-compliant product. Material procurement and management services include plan- ning, purchasing, expediting, and warehousing of components and ma- terials. Digicom has ISO 9001:2008, ISO 13485:2003 medical devices quality, quality system regulation 21 CFR 820, mil-spec 45208, ITAR, and


other certifications. Contact: Digicom Electronics,


Inc., 7799 Pardee Lane, Oakland, CA 94621 % 510-639-7003 fax: 510- 639-7090 E-mail: info@digicom.org Web: www.digicom.com


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