December, 2016
www.us-
tech.com
Page 25 Wacker Adds to Lumisil Line of Encapsulants
Adrian, MI — Wacker is unveiling two new encap- sulation compounds for LEDs. The Lumisil® 740 and 770 cure to form highly-transparent silicone elastomers. Both silicones withstand exceptionally high operating temperatures and strong light radi- ation without yellowing or becoming brittle, mak- ing them useful for high-performance LEDs. The two-component LED encapsulants cure
at room temperature through a platinum-cat- alyzed addition reaction. Typical of polydimethyl- siloxanes, the cured rubber grades have a refrac- tive index of 1.41, including them in the family of normal refractive index (NRI) encapsulants. A special feature of the 740 and 770 is their
extremely high heat, light and thermal shock re- sistance. After 500 hours of storage at 245°C (473°F), Lumisil 740 displayed neither yellowing nor embrittlement. Even after 1,000 hours, the change in the cured rubber grades was insignifi- cant. The 740 has proven particular- ly resistant to combined heat and light exposure. In a thermal shock test from +125 to –45°C (257 to –49°F), both materials are able to withstand more than 1,000 test cy- cles. The encapsulation compounds thus compensate for the thermo-me- chanical stresses that arise as a re- sult of differing thermal expansions in the LED materials.
Mycronic Delivers High-Volume Jet Printers
Rowley, MA —Mycronic has received an order for several MY600 jet print- er systems from a high-volume man- ufacturer based in Asia. The cus-
Due to their stability, the new silicones are
particularly suitable for encapsulating LED chips with strong heat generation and intense light emis- sion. The two grades differ mainly in the hardness
of the cured products. Lumisil 740 cures to form a material with a Shore A hardness of 50, while the 770 is formulated to be slightly harder at Shore A 70. Lumisil 740 is useful for the encapsulation of multi-chip LEDs that are applied using the chip-on- board technology —mounted directly onto the print- ed circuit board, tightly packed, without casing. Lu- misil 770, on the other hand, is a good material for encapsulating single-chip LEDs. The viscosity of the two encapsulation mate-
rials has been adjusted so that they can easily be applied by dispensing. Both materials are self-ad- hesive. They adhere to the semiconductor chip and to conventional reflector and casing substrates
without pretreatment. Contact: Wacker Chemical Corp., 3301 Sutton
Dispensable NRI LED encapsulant.
Road, Adrian, MI 49221 % 888-922-5374 fax: 517-264-8246 E-mail:
info.usa@
wacker.com Web:
www.wacker.com
MY600 jet printer.
tomer has several 24-hour produc- tion locations in the region. This order is the third of its kind from the customer and delivery is set to take place before the end of 2016. Mycronic offers electronics
manufacturing equipment including production systems for non-contact application of solder paste and other materials, robotic mounting systems for component placement, automated storage systems, and advanced soft- ware for effective process manage- ment. The company’s equipment is used globally in many areas of the electronics manufacturing industry. Traditionally, the company has fo- cused on offering systems to cus- tomers with low-to-mid volume man- ufacturing where the need for flexi- bility is high. The MY600 was devel- oped to offer the electronics industry a competitive alternative or a com- plement to the traditional stencil printer. The systems can also be con- figured for high-speed dispensing of
several kinds of mounting fluids. Contact: Mycronic, Inc., 320
Newburyport Turnpike, Rowley, MA 01969 % 978-948-6919 fax: 978-948- 6915 Web:
www.mycronic.com
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