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www.us-
tech.com
June, 2016 Automatic Placement System
Glassboro, NJ — Essemtec, a manu- facturer of production systems for electronic assembly and packaging, has launched its new Fox automatic pick-and-place system. The machine has been designed to save production space without compromising produc- tivity and placement quality. The mechanical design includes
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cutting-edge drive and materials tech- nologies, which reduce maintenance while increasing stability. With a small footprint of 88 x 109 cm (34.7 x 42.9 in.), the Fox fits through stan- dard doors. It weighs in at just under one metric ton. The machine is envi- ronmentally friendly, consuming less than 750 W of power using single- phase 230 V and recouping energy from its motion system. The adaptive system places com-
ponents from 0201 to 33 x 80 mm (1.3 x 3.2 in.) and also dispenses solder paste and SMT glue. It accepts 180 in- telligent feeders and allows for chaot- ic placement and hot swapping, which enables product changes in under a minute. The Fox is compatible with
feeders from the company’s previous machines. The equipment places com- ponents at 4500 cph (IPC 8950A) with an accuracy stated at 60 µm, which improves at slower speeds. It handles board sizes of 300 x 400 mm (11.8 x 15.8 in.), component height of 30 mm (1.2 in.), and is able to place on multi- ple levels for 2.5D applications. The system comes equipped
with an 18 in. touchscreen and runs on ePlace software, the company’s manufacturing software with visual- ization, component library, CAD con- version, remote diagnostics and on- line help. Its ePlace software also supports line balancing so multiple Fox systems can be combined in-line. The system also integrates with Cubus storage devices and new reels can be ordered directly from the low- component monitor. Contact: Essemtec USA, 816 N
Delsea Drive, Suite 308, Glassboro, NJ 08028 % 856-218-1131 fax: 856-218-1134 E-mail:
info@assemtec-usa.com Web:
www.essemtec-usa.com
miller-stephenson chemical company, inc.
Connecticut - Illinois - California - Canada 800.992.2424 or 203.743.4447
miller-stephenson.com supportUT@mschem.com DuPont™, Krytox® and Vertrel® are registered trademarks of E.I. du Pont™ de Nemours and Company or its affiliates. e
Instant Reflow Oven Changeover...
Continued from previous page
diction software will select the cor- rect oven setup a few seconds after the completed profile. This is a simu- lated result, so verifying the accura- cy of the prediction by running a pro- file on the PCBs after the oven has stabilized on its new settings is en- couraged. Note that this method can also
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• Wide Range Thermal Head (WRTH)
• -55°C to + 155°C temperature range
• +/- 0.5 degree temperature control
• No fluids required • 110 VAC 60Hz @ 4 amps
• Built-in purge cover for thermal head and test socket
• Includes one set of thermal head tooling, designed to match a specific device and test socket
www.exatron.com
1-800-EXA-TRON 1-408-629-7600
be used when individual components on the same assembly have different process windows. The data mining software will search for an oven recipe that positions the profile inside every process win- dow for each measured component on the two PCBs. The probability is high that all the other boards that fall between the two extremes used for the recipe generation will have a profile in spec as well.
take a long time to stabilize a new temperature, the change in conveyor speed is nearly instant. To avoid the risk of a bottleneck at the oven, limit the range of allowable conveyor speeds to a minimum speed that is faster than the rest of the line. If the temperature must be
changed in the oven, production planning should consider that an
Essemtec Launches Fox
Many assemblies can be accommodated by a single “golden” profile.
For a less capable reflow oven,
or for a wider range of either thermal mass assemblies or process windows, it is not likely that there will be a sin- gle oven setup that can handle every- thing. In that case, follow the same method as described above, but nar- row the grouping of PCBs. Users may end up with two recipes; small vs. large PCBs, for example, or three or four groupings. There will still be oven changeover delays, but limited to the few recipes that there are. Even in this scenario, it may be pos- sible to reduce or eliminate the changeover time. Prediction software or oven
setup software allows control over the variables that are used for find- ing the ideal recipe. For instance, software can filter results by convey- or speed or zone temperature. De- pending on the application, it may be possible to get in spec on all or most assemblies simply by changing the conveyor speed. While an oven may
oven heats up faster than it cools down. One strategy is to start pro- duction with the coolest recipe and progressively go hotter throughout the day. It is not uncommon for high-mix
electronics assembly factories to have more downtime due to changeover than actual production time. It is important to take a holis- tic view of production changeover for each line, as well as the entire opera- tion. When drilling down to the indi- vidual machines, the biggest drag on productivity may be the ovens. The use of more effective production plan- ning and scheduling, as well as using data mining software to identify a few oven recipes can improve line changeover time dramatically and result in higher profits. Contact: KIC Thermal, 16120
W. Bernardo Drive, San Diego, CA 92127 % 858-673-6050 fax: 858-673- 0085 E-mail:
bdahle@kicmail.com Web:
www.kicthermal.com r
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