December, 2014
www.us-
tech.com
Page 55
Mirtec: Delivering Tomorrow’s Inspection Technology Today Continued from previous page
the OMNI-VISION® 2D/3D Inspec - tion Technology combines the compa- ny’s exclusive 25 Mpixel two-dimen- sional
Technology with a proprietary three- dimensional
(2D) CoaXPress Camera (3D) Digital Multi-
Frequency Moiré System to provide precision inspection of SMT devices on finished PCB assemblies. As D’Amico adds: “This advanced tech- nology not only provides unprecedent- ed speed and performance to the elec- tronics inspection industry, but has set a new standard by which all other inspection equipment is measured.” For years, the AOI industry has
relied solely upon 2D inspection meth- ods to test the quality of workmanship on electronic assemblies. While advancements in conven-
tional 2D optical inspection have made this technology suitable for detecting such defects as missing components, wrong components, proper or improper component orientation, and insuffi- cient solder and solder bridges, there is an inherent limitation in the capability of 2D approaches to inspect for copla- narity of ultraminiature chips, leaded devices, and BGA and LED packaged devices. True coplanarity in spection of these devices is necessary and requires full 3D inspection capability.
2D vs. 3D Inspection There are both advantages and
disadvantages to 2D and 3D inspec- tion technologies. For the highest level of quality assurance, a practical
MV-9XP LED Inspection Machine.
ogies. According to D’Amico: “Mir tec has several exciting developments with camera and sensor technologies but, we need to keep these close to the vest until we are ready to release them.” He does disclose an advance that should help many electronics manufacturers: “Mirtec is making big advances in process feedback control. No longer does the customer simply rely upon their inspection system to catch ‘bad’ PCBs. Now the company has the means to help them stop mak- ing them (bad PCBs) in the first place.” D’Amico concludes: “We believe this will become a standard requirement for the world’s most advanced manu- facturers, and again, Mirtec has the solution ready for them.” Contact: Mirtec Corp., 3 Morse
Road, Oxford, CT 06478 % 800-420-4514 or 203-881-5559 (Brian D’Amico) fax : 203-881-3322 E-mail:
bkdamico@sbcglobal.net Web:
www.Mirtec.com r
25 Mpixel CoaXPress camera supports high-resolution AOI.
and effective AOI system should combine both technologies in a single platform. Mirtec recognized that 3D inspection technology could comple- ment the capabilities of its award- winning 2D technology, not replace them, and developed a 2D/3D solu- tion that combines both approaches for the best results.
2D optical inspection is
suitable for detecting such defects as missing components, wrong
components, proper or improper component orientation, and
insufficient solder and
solder bridges. But it falls short of providing needed true 3D information.
In addition to LED production,
industrial cameras, and 2D/3D inspec- tion solutions, the company is looking at other potentially significant technol -
Page 1 |
Page 2 |
Page 3 |
Page 4 |
Page 5 |
Page 6 |
Page 7 |
Page 8 |
Page 9 |
Page 10 |
Page 11 |
Page 12 |
Page 13 |
Page 14 |
Page 15 |
Page 16 |
Page 17 |
Page 18 |
Page 19 |
Page 20 |
Page 21 |
Page 22 |
Page 23 |
Page 24 |
Page 25 |
Page 26 |
Page 27 |
Page 28 |
Page 29 |
Page 30 |
Page 31 |
Page 32 |
Page 33 |
Page 34 |
Page 35 |
Page 36 |
Page 37 |
Page 38 |
Page 39 |
Page 40 |
Page 41 |
Page 42 |
Page 43 |
Page 44 |
Page 45 |
Page 46 |
Page 47 |
Page 48 |
Page 49 |
Page 50 |
Page 51 |
Page 52 |
Page 53 |
Page 54 |
Page 55 |
Page 56 |
Page 57 |
Page 58 |
Page 59 |
Page 60 |
Page 61 |
Page 62 |
Page 63 |
Page 64 |
Page 65 |
Page 66 |
Page 67 |
Page 68 |
Page 69 |
Page 70 |
Page 71 |
Page 72 |
Page 73 |
Page 74 |
Page 75 |
Page 76 |
Page 77 |
Page 78 |
Page 79 |
Page 80