December, 2014
www.us-
tech.com
Page 23 ACE Offers Automatic Board Warpage Compensation
Spokane Valley, WA — ACE Production Technolo- gies, Inc.’s new automatic board warpage compen- sation system is now a standard feature on all KISS in-line and manual load selective soldering machines at no additional cost. A considerable advantage of the ACE auto-
matic board warpage compensation system is that it operates by determining the amount of board warpage, or sag, in relation to the bottom plane of the board or SMEMA conveyor height when a printed circuit board is preheated. This value is entered as a negative Z-axis value and all solder nozzle Z-axis heights for the entire board are auto- matically recalculated by an algorithm and cor- rected based upon the X-Y coordinates of each sol- der joint. Unlike some competitive offerings, the ACE
automatic board warpage compensation system is fully compatible with printed circuit boards that
Alpha Intros LED Mfg. Materials Technologies
Somerset, NJ — Alpha has intro- duced its new line of ALPHA LED compatible materials technologies. These product technologies provide the needed performance and value across the LED lighting system man- ufacturing process, including: die at- tach and package, package on board, luminaire
module, power driver/supply and control systems.
contain tooling holes, slots or bottom-side SMT components. Competitive laser-based board warpage sys-
tems often encounter interference or reading feed- back difficulties with boards that have open tool- ing holes, routings, score marks or unsoldered leads. In some instances laser-based systems will
give variable feedback and can be affected by re- flectivity of the solder mask so an operator must be aware of these issues. The ACE board warpage system is totally un-
affected by cutouts, slots or solder mask reflectivi- ty. An additional benefit is that it is much faster to set up and does not add to the process time as con- ventional laser-based systems do. All KISS selective soldering machines
equipped with the new SWAK-OS operating sys- tem software now have the automatic board warpage compensation function as a standard fea- ture including all in-line, standalone and manual
load systems. Contact: ACE Production Technologies, 3010
PCB warpage automatically compensated for during selective soldering.
N. First Street, Spokane Valley, WA 99216 % 509-924-4898 fax: 509-533-1299
E-mail:
sales@ace-protech.com Web:
www.ace-protech.com
Lumet solder paste. According to the company, its
strong understanding of emerging trends in LED markets and applica- tions, as well as its strong focus on R&D has resulted in several innova- tive products for the LED market — its leading-edge LED die attach and assembly materials products for ap- plications such as super high power LED attach, flip chip bonding, chip on board, and LED package assem- bly on PET flex circuits. The company is introducing
Lumet™ P53 solder paste with SBX02 alloy for LED package assembly on PET flexible circuits. Enabling use of PET flexible circuits can provide sig- nificant system cost benefits compared to either FR4 rigid boards or Poly- imide flexible circuits. Lumet P53 solder paste with
SBX02 alloy provides low tempera- ture LED package on PET reflow ca- pability, which enables the use of PET flex substrates. Lumet P53 with SBX02 alloy for LED package on PET assembly also enables the use of SAC or MAXREL™ solder based die at- tach in package, by providing the re- quired temperature cascade for pre- venting secondary reflow of the die
attach layer. Contact: Alpha, 300 Atrium
Drive, Somerset, NJ 08873 % 908-791-3000
fax: 908-791-3090 Web:
www.alpha.alent.com
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