December, 2014
www.us-
tech.com
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Portable Tester from Megger for Domestic and Europe-Bound Electrical Equipment
Norristown, PA — Megger now offers the PAT450, a portable appliance tester designed to test portable electrical equipment for safe operation. Suitable for portable appliance testing in locations like service workshops, hotels, schools, hospitals, prisons, long term care facilities, construction sites, offices, restaurants and sport facilities, the PAT450 can store up to 10,000 test results. It in- cludes 10A and 25A bond tests with high duty- cycle designed for fast testing, easy operation and all-day use. The PAT’s 250V and 500V insulation tests protect sensitive electronics. Because the new PAT450 conforms to the lat-
est European regulations and standards, it en- ables US companies shipping electrical products internationally to ensure that their exported products will pass import testing. A USB port enables convenient
download to a standard USB memory stick. A barcode scanner and thermal transfer barcode label printer can be used with the tester when hooked up to the USB port. A restart feature on the PAT450
allows the unit to restart instantly from the same menu where it was un- plugged when moving from room to room. This saves time, allowing more tests in a single day. The tester can perform a variety
of tests such as an earth bond conti- nuity test that verifies the integrity of exposed metalwork on grounded (Class I) appliances; an insulation test that checks that equipment con- ductors are isolated from ground to 500VDC and a touch-current test that powers the asset at the supply voltage as if it were in use. Other tests offered include a dif-
ferential leakage test that evaluates the difference in current between the live and neutral conductor measured
Yincae Intros Solder Joint
Encapsulant Albany, NY — Yincae Advanced Ma- terials, LLC has introduced BP 256 solder joint encapsulant, a part of the innovative SMT 256/266 series. The product is for BGA, CSP, Flip Chip, POP, and other ball bumping appli- cations. The BP 256 can enhance sol- der joint reliability and eliminate sol- der joint cracking in microchip appli- cations, creating a solder joint bond that is 5-to-10 times stronger than a conventional solder joint. Using BP 256 eliminates the
cleaning process because of the na- ture of epoxy and the later underfill- ing process. The products are also de- signed for use in lead-free, Sn/Pb and Sn/Bi processes. Although encapsulant products
are not new, the industry has been hard-pressed to find an encapsulant that performs like the BP 256. The new material eliminates the need for flux, underfilling, and the cleaning process. It reportedly demonstrates superior performance, can be applied at low temperatures, and is 100 per-
cent reworkable. Contact: Yincae Advanced Mate-
rials, LLC, 19 Walker Way, Albany, NY 12205 % 518-452-2880 E-mail:
info@yincae.com Web:
www.yincae.com
Automated optical inspection with multiple reflection suppression for electronics assembly. Technology that captures, transmits and interprets inspection data faster and more accurately than competing technology.
Coming soon from CyberOptics.
763.542.5000 |
info@cyberoptics.com |
www.cyberoptics.com Copyright © 2014. CyberOptics®
Portable appliance tester.
during operation; a substitute/alternative leakage test; a functional load test to ensure the asset works as it should; and a hi-pot/flash test per- formed to check for leakage current between the linked live/neutral conductors and the probe. The instrument also tests extension and
power cords. The PAT450 has a large 5.7-in. 1/2 VGA back-
lit color screen for clear results with simplified menus for easy intuitive operation. The unit’s se- lectable pass/fail limits provide instant indication
of a faulty asset. Contact: Megger, 2621 Van Buren Avenue,
Norristown, PA 19403 % 800-723-2861 or 610-676-8536 Web:
www.megger.com
See Past The Illusion
In a way like never before. At a speed that cannot be matched.
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