Page 54
www.us-
tech.com
December, 2014
Mirtec: Delivering Tomorrow’s Inspection Technology Today
By Megan Jergens, Mirtec Corp. T
he latest industry challenge comes from the LED fabrica- tion sector, and Mirtec, closely
monitoring this emerging trend, has entered the LED arena with the debut of the MV-9XP LED Package Inspection System, with technology specifically developed to address the inspection requirements of the LED manufacturing industry. AOI can be applied at two different stages of the LED packaging process. In the first stage, the bond wire, chip die, and stitch ball are inspected for defects prior to encapsulation. In the second stage, which is the post-encapsula- tion stage, the epoxy is inspected for foreign materials, bubbles, and suffi- cient volume. The MV-9XP LED Package Inspection System is config- ured with a 15 Mpixel camera com- bined with an ultra-high-resolution 5µm telecentric lens and high-inten- sity blue LED lighting to perform bond wire, chip die, and stitch ball inspection of LED packages prior to encapsulation. As a leading global supplier of
automated optical inspection (AOI) systems to the electronic manufac-
Mirtec established
ISVI Corp. to design and manufacture high-speed, high-resolution camera systems for its full line of inspection
equipment products.
turing industry, Mirtec has aided manufacturers of high-volume prod- ucts, such as cellular telephones and MP3 players, as well as makers of lower volume electronic products for aerospace, defense, automotive, and medical electronics markets. With divisions in Europe, Japan, China, Korea, and the United States, the company tries to live up to its nick- name as “The Global Leader in Inspection Technology.” The company has grown rapidly
over the last 15 years, through con- stant innovation and worldwide expansion of its sales and service
networks. During the past decade, for example, Mirtec has established 11 worldwide “Centers of Excel - lence.” The company opened sub- sidiaries in the United States and Hong Kong, China in 2004 as well as a new manufacturing plant in An- sung, South Korea and a European
more. Customers include OEMs, sys- tem integrators, end-users, resear - chers and developers.” ISVI has posted strong growth
figures. D’Amico pointed out that the electronics manufacturing industry has a wide range of demanding inspection requirements. On one side
growing number of original-equip- ment-manufacturer (OEM) and elec- tronic-manufacturing-services (EMS) providers realize the need for improved inspection capabilities and are investing in new inspection equipment capable of meeting higher standards of productivity. In support of its high-perform-
ance inspection solutions, the compa- ny invests heavily in R&D. The firm melds sophisticated vision algo- rithms with state-of-the-art optics, lighting, and laser technologies in driving for consistent product inno- vation and performance improve- ments. By combining steady innova- tion with a talented team of sales and support professionals, the com- pany has fared well in a highly com- petitive industry. Mirtec listens closely to its cus-
OMNI-VISION 2D/3D Inspection Technology.
subsidiary in 2008. In 2009, Mirtec opened local support centers in Vietnam and China, followed by offi- cial incorporation in China in 2011. In 2012, the firm established a Core Technology Research Center in Korea and opened support offices in Slovakia and Hungary. The company founded a Fusion Technology Center in 2013, followed by official incorpo- ration in Japan. As part of its ongo- ing expansion, it is in the process of opening a Competence Center in Germany to meet growing demand for its equipment in that area. In 2010 Mirtec established ISVI
Corp., to design and manufacture high-speed, high-resolution camera systems for its full line of inspection equipment products. According to Brian D’Amico, president of Mirtec’s North American Sales and Service Division: “Based on the overwhelm- ing success of these advanced camera systems, ISVI began to market its camera products worldwide and has quickly become a recognized leader in this industry.” He added: “ISVI services span a wide range of indus- trial camera applications such as microscopy, machine vision, factory automation, robotics, medical and
are the high-speed, high-volume pro- duction requirements associated with mobile device and light-emit- ting-diode (LED) back light unit (BLU) product manufacturing. On the other end of the spectrum are the high-end, precision inspection re - quirements for microelectronic com- ponent manufacturing. A number of industrial camera manufacturers have developed cameras suitable for manufacturing inspection applica- tions, but Mirtec has tried to meet the needs of this diverse range of requirements with some of the indus- try’s most cost-effective solutions.
Changing Global Market By seeking to add value to sur-
face-mount-technology (SMT) proces - ses and manufacturing, Mirtec has supported a wide range of electronic manufacturing requirements and also achieved consistent revenue growth for several years. Current global market conditions are also helping to fuel that growth. Ad - vances within the electronics manu- facturing industry have led to a trend of increasing density and com- plexity of printed-circuit boards (PCBs). As a result of this trend, a
tomers, creating practical products that meet their needs. By combining strong skills in R&D with capabilities to actually build what they design, the company’s product developers can respond to customer needs. As D’Amico notes: “We also are unique in that we are the only AOI company that actually manufactures its own
Brian D’Amico -- President of
Mitrec’s North American Sales and Service Division.
optics. This has allowed Mirtec to offer unparalleled advantages with which all other manufacturers are unable to compete.” As an example,
Continued on next page
Page 1 |
Page 2 |
Page 3 |
Page 4 |
Page 5 |
Page 6 |
Page 7 |
Page 8 |
Page 9 |
Page 10 |
Page 11 |
Page 12 |
Page 13 |
Page 14 |
Page 15 |
Page 16 |
Page 17 |
Page 18 |
Page 19 |
Page 20 |
Page 21 |
Page 22 |
Page 23 |
Page 24 |
Page 25 |
Page 26 |
Page 27 |
Page 28 |
Page 29 |
Page 30 |
Page 31 |
Page 32 |
Page 33 |
Page 34 |
Page 35 |
Page 36 |
Page 37 |
Page 38 |
Page 39 |
Page 40 |
Page 41 |
Page 42 |
Page 43 |
Page 44 |
Page 45 |
Page 46 |
Page 47 |
Page 48 |
Page 49 |
Page 50 |
Page 51 |
Page 52 |
Page 53 |
Page 54 |
Page 55 |
Page 56 |
Page 57 |
Page 58 |
Page 59 |
Page 60 |
Page 61 |
Page 62 |
Page 63 |
Page 64 |
Page 65 |
Page 66 |
Page 67 |
Page 68 |
Page 69 |
Page 70 |
Page 71 |
Page 72 |
Page 73 |
Page 74 |
Page 75 |
Page 76 |
Page 77 |
Page 78 |
Page 79 |
Page 80