Equipment and Materials ♦ news digest
WaferStorm TSV CLEANER
TSV clean is a critical process step that is essential to reliability. The deep reactive ion etch (DRIE) process leaves behind a polymer residue which can lead to defects and voids in the barrier, seed, and fill steps that follow. SSEC’s WaferStorm TSV CLEANER is proven to remove residues in high-aspect-ratio holes that wet bench-only or spray-only tools leave behind. The tool features equal-time soak software for process control.
WaferStorm DRY FILM REMOVER
Removal of dry film resists used in advanced microbumping processes for 3D ICs and wafer level packaging (WLP) applications is a challenge due to the film thickness and composition. The SSEC WaferStorm DRY FILM REMOVER combines heated chemistries and proprietary soak and spray at high pressure for rapid and complete removal of stubborn dry film residue.
The soak step uses heated solvents throughout the buffer cycle time. After being softened by the soak, the wafers are transferred to the single-wafer spray station where they are exposed to high-pressure fan sprays with heated solvents for rapid removal of dry film residue. This combination ensures thorough removal and increased throughput.
SEMATECH & Air Products
unite to advance III-Vs Air Products will collaborate with SEMATECH’s engineers to better understand the underlying principles responsible for the deposition of III-V structures
WaferStorm METAL LIFTER
Metal lift-off consists of the sequential steps of photolithography, metal deposition, and solvent lift-off of both metal and non-metal substances in MEMS and compound semiconductor applications. The SSEC WaferStorm METAL LIFTER is configured specifically to perform the sequential soak and spray combinations unique to the process.
The immersion station operates in a low-oxygen atmosphere, which maintains the bath longer. Following a soak in the immersion tank, lift-off takes place in a spray station using a high-pressure chemical spray, which translates to increased throughput. The tool features a lift-off material filtration station and strainers for separating metal films, which results in the complete removal of the metal.
Air Products, a global provider of industrial gases, used in MOCVD growth, has joined SEMATECH’s Front End Processes (FEP) program.
Air Products will work with SEMATECH to assess advanced materials and technologies for the development of sub-10 nm node III-V devices.
Continued scaling will require the use of new materials and chemistries to keep pace with the International Technology Roadmap for Semiconductors (ITRS). For example, III-V channels offer significant power and performance benefits, such as higher mobility, enhanced drive current and supply voltage scaling which enable continued device scaling and performance improvement.
As a member of this program, located at SUNY’s College of Nanoscale Science and Engineering (CNSE), Air Products will
August/September 2013
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