Power Electronics ♦ news digest
pleased that the University of Wroclaw has chosen our system for its most advanced centre TECHNOPOLIS and are looking forward to continue our close collaboration with our customer’s excellent technical team.”
The centre is co-funded by the European Union from the European Regional Development Fund within the framework of the Infrastructure and Environmental Programme and Poland’s national budget.
Doctoral and masters students will be trained in the centre to participate in strategic economic activities such as automatics and robotics, electronics and telecommunications, computer science and teleinformatics.
TECHNOPOLIS is an investment endeavour whose purpose is to establish fundamentals for the development of educational infrastructure enabling highest quality education, necessary for the creation of knowledge society and encouraging economic growth in the region concerned.
US announces CIGS roadmap
The PV Roadmap aims to identify common challenges and define the areas of technical developments needed to sustain and advance a competitive U.S. photovoltaics market
The U.S. Photovoltaic Manufacturing Consortium (PVMC),has released the first-ever U.S. CIGS PV Roadmap reports.
The PVMC is an industry-led collaboration headquartered at SUNY’s College of Nanoscale Science and Engineering (CNSE) in New York that is designed to accelerate next- generation solar photovoltaic (PV) technologies,
“Photovoltaics and especially thin-film PV are again at a tipping point,” says Larry Kazmerski, co-chair of the U.S. CIGS PV Roadmap. “We want PV to be a substantial part of the world’s energy portfolio and our efforts with this roadmap are aimed to help make CIGS thin films a significant part of that solar success.”
“In building on the innovation strategy of Governor Andrew Cuomo that is establishing New York as a hub for solar energy technologies and companies, we engaged over 75 partner firms and 100 industry experts to develop a 10-year projection in the first-ever U.S. CIGS PV roadmap,” continues Pradeep Haldar, PVMC Chief Operating and Technology Officer and CNSE Vice President for Clean Energy Programs.
“This blueprint identifies the critical challenges for CIGS PV manufacturing, applications for sustainable innovation, and technical developments that will serve our members and stakeholders, and enable a competitive U.S. solar industry amid the global marketplace.”
Spearheaded by SEMATECH and CNSE as part of the U.S. Department of Energy’s (DOE) SunShot Initiative, PVMC is targeting a reduction in the total installed cost of solar energy systems by 75 percent over the next decade.
The CIGS PV Roadmap aims to provide a congruent plan for the national CIGS industry, including module and systems manufacturers, suppliers, and end-users, that will identify common challenges and define the areas of technical developments needed to sustain and advance a competitive U.S. photovoltaic industry.
The annual roadmap entitled “2013 U.S. CIGS PV Roadmap Reports,” identifies the technology challenges to attain projected module cost and performance targets over the next 10 years. The various reports, based on the latest industry analysis, advance the effort for achieving the SunShot initiative target.
The roadmap addresses six focus areas relevant to the entire industry, including roll-to-roll, rigid glass, metrology, modules and packaging, substrates and materials, and reliability/ certification/test. Each section outlines the current status and critical challenges for each technology, discusses the role of industry standards for CIGS, and potential areas of innovation for the pre-competitive domain.
As the primary sponsor of the effort, PVMC provides the resources for managing and coordinating the roadmap activities. Members of the CIGS PV Roadmap represent all areas of the PV industry, including module producers and integrators, equipment suppliers, materials and metrology tools, end-users, and the research community.
Power Electronics
GaN Systems puts silicon power devices in the shade
The firm’s gallium nitride “Island Technology” packs more power in a quarter of the space of silicon devices
GaN Systems develops the most complete range of GaN power switching solutions available and is focussed on the easy adoption of GaN by design and systems engineers.
The firm’s proprietary Island Technology produces devices that are significantly smaller and more efficient than traditional design approaches. GaN Systems has access to fabs around the globe and the company’s executives will be on-hand to discuss potential applications with attendees.
The European Conference on Power Electronics and Applications is a world forum for presentation and discussion of the latest development in power electronics, reflecting the increasing importance of this technology in fields such as clean transportation systems for both mass and individual transportation, energy production systems and industrial applications.
August/September 2013
www.compoundsemiconductor.net 131
Page 1 |
Page 2 |
Page 3 |
Page 4 |
Page 5 |
Page 6 |
Page 7 |
Page 8 |
Page 9 |
Page 10 |
Page 11 |
Page 12 |
Page 13 |
Page 14 |
Page 15 |
Page 16 |
Page 17 |
Page 18 |
Page 19 |
Page 20 |
Page 21 |
Page 22 |
Page 23 |
Page 24 |
Page 25 |
Page 26 |
Page 27 |
Page 28 |
Page 29 |
Page 30 |
Page 31 |
Page 32 |
Page 33 |
Page 34 |
Page 35 |
Page 36 |
Page 37 |
Page 38 |
Page 39 |
Page 40 |
Page 41 |
Page 42 |
Page 43 |
Page 44 |
Page 45 |
Page 46 |
Page 47 |
Page 48 |
Page 49 |
Page 50 |
Page 51 |
Page 52 |
Page 53 |
Page 54 |
Page 55 |
Page 56 |
Page 57 |
Page 58 |
Page 59 |
Page 60 |
Page 61 |
Page 62 |
Page 63 |
Page 64 |
Page 65 |
Page 66 |
Page 67 |
Page 68 |
Page 69 |
Page 70 |
Page 71 |
Page 72 |
Page 73 |
Page 74 |
Page 75 |
Page 76 |
Page 77 |
Page 78 |
Page 79 |
Page 80 |
Page 81 |
Page 82 |
Page 83 |
Page 84 |
Page 85 |
Page 86 |
Page 87 |
Page 88 |
Page 89 |
Page 90 |
Page 91 |
Page 92 |
Page 93 |
Page 94 |
Page 95 |
Page 96 |
Page 97 |
Page 98 |
Page 99 |
Page 100 |
Page 101 |
Page 102 |
Page 103 |
Page 104 |
Page 105 |
Page 106 |
Page 107 |
Page 108 |
Page 109 |
Page 110 |
Page 111 |
Page 112 |
Page 113 |
Page 114 |
Page 115 |
Page 116 |
Page 117 |
Page 118 |
Page 119 |
Page 120 |
Page 121 |
Page 122 |
Page 123 |
Page 124 |
Page 125 |
Page 126 |
Page 127 |
Page 128 |
Page 129 |
Page 130 |
Page 131 |
Page 132 |
Page 133 |
Page 134 |
Page 135 |
Page 136 |
Page 137 |
Page 138 |
Page 139 |
Page 140 |
Page 141 |
Page 142 |
Page 143 |
Page 144 |
Page 145 |
Page 146 |
Page 147 |
Page 148 |
Page 149 |
Page 150 |
Page 151 |
Page 152 |
Page 153 |
Page 154 |
Page 155 |
Page 156 |
Page 157 |
Page 158 |
Page 159 |
Page 160 |
Page 161 |
Page 162 |
Page 163 |
Page 164 |
Page 165 |
Page 166 |
Page 167 |
Page 168 |
Page 169 |
Page 170 |
Page 171 |
Page 172 |
Page 173 |
Page 174 |
Page 175 |
Page 176 |
Page 177 |
Page 178