Equipment and Materials ♦ news digest


SCOUT can be used safely in areas where people and machines work closely together


Launched in 2012, the SPECTOR-HT Ion Beam Deposition System provides up to 400 percent increase in throughput, 300 percent increase in target utilisation and 50 percent improvement in material uniformity compared to previous generations of ion beam sputtering equipment. It also offers exceptional film quality, and a cost-effective manufacturing platform.


Veeco says it is the industry’s first fully automated ion beam deposition system to achieve accelerated deposition rates at speeds comparable to competing optical deposition technologies, such as physical vapour deposition (PVD), evaporative coatings or ion assisted deposition, while maintaining high quality, optimal films.


Robot automated transportation for


cleanrooms revealed The robot is cleanroom suitable up to ISO class 3 / US FED class 1 and has more than 5,000 km of autonomous navigation in clean rooms


Roth & Rau - Ortner, a factory automation specialist, and its partner MetraLabs Automation, a provider of freely navigating autonomous mobile robots, have introduced their jointly- developed mobile robot, SCOUT at SEMICON West.


SCOUT has been specially developed for the flexible and automated transportation of materials in semiconductor fabs and other clean production environments.


SCOUT navigates autonomously, without any kind of guidance system and communicates via WiFi and operator GUI to issue new transport jobs and show important status information like its current position. The robot is cleanroom suitable up to ISO class 3 / US FED class 1 and has more than 5,000 km of autonomous navigation in clean rooms, which proves its reliability.


SCOUT at work in a semiconductor cleanroom


Roth & Rau - Ortner and MetraLabs will demonstrate SCOUT’s reticle transportation application at SEMICON West in booth # 1831, South Hall.


August/September 2013 www.compoundsemiconductor.net 165


“Thanks to its compact size and reliable sensor technology, SCOUT can be used safely in areas where people and machines work closely together,” explains Matthias Merten, CEO of MetraLabs Automation, Inc. “This makes SCOUT an ideal alternative in cases where a permanently installed transport system such as a rail or a conveyor system cannot be implemented or would be too expensive.


SCOUT is capable of transporting various materials and products between any point in the fab, taking measurements, providing tools and auxiliaries. Various attachments like mechanical manipulators (e.g. robot arms or linear axis) and transportation trays (e.g. for the transportation of four SMIF Pods or HA200 storage boxes) enable SCOUT to be adjusted to different conditions according to the desired use.


“SCOUT is an integral part of our “Missing Link” concept, which covers custom-tailored automation solutions for existing semiconductor fabs. These solutions are primarily directed at semi-automated production lines with high requirements for personnel because they can cut costs dramatically by minimising downtime and freeing up manpower,” adds Karli Hantzschmann, Division Manager Automation of Roth & Rau - Ortner.


Older wafer fabrication businesses often called for cassettes to be handled manually between the production processes. This tied up valuable assets, such as staff; required high investments in time and cost and was prone to error.


Ortner’s solution replaces formerly manual links between two work steps, improving the process for transportation, tool loading, storage and identification.


Page 1  |  Page 2  |  Page 3  |  Page 4  |  Page 5  |  Page 6  |  Page 7  |  Page 8  |  Page 9  |  Page 10  |  Page 11  |  Page 12  |  Page 13  |  Page 14  |  Page 15  |  Page 16  |  Page 17  |  Page 18  |  Page 19  |  Page 20  |  Page 21  |  Page 22  |  Page 23  |  Page 24  |  Page 25  |  Page 26  |  Page 27  |  Page 28  |  Page 29  |  Page 30  |  Page 31  |  Page 32  |  Page 33  |  Page 34  |  Page 35  |  Page 36  |  Page 37  |  Page 38  |  Page 39  |  Page 40  |  Page 41  |  Page 42  |  Page 43  |  Page 44  |  Page 45  |  Page 46  |  Page 47  |  Page 48  |  Page 49  |  Page 50  |  Page 51  |  Page 52  |  Page 53  |  Page 54  |  Page 55  |  Page 56  |  Page 57  |  Page 58  |  Page 59  |  Page 60  |  Page 61  |  Page 62  |  Page 63  |  Page 64  |  Page 65  |  Page 66  |  Page 67  |  Page 68  |  Page 69  |  Page 70  |  Page 71  |  Page 72  |  Page 73  |  Page 74  |  Page 75  |  Page 76  |  Page 77  |  Page 78  |  Page 79  |  Page 80  |  Page 81  |  Page 82  |  Page 83  |  Page 84  |  Page 85  |  Page 86  |  Page 87  |  Page 88  |  Page 89  |  Page 90  |  Page 91  |  Page 92  |  Page 93  |  Page 94  |  Page 95  |  Page 96  |  Page 97  |  Page 98  |  Page 99  |  Page 100  |  Page 101  |  Page 102  |  Page 103  |  Page 104  |  Page 105  |  Page 106  |  Page 107  |  Page 108  |  Page 109  |  Page 110  |  Page 111  |  Page 112  |  Page 113  |  Page 114  |  Page 115  |  Page 116  |  Page 117  |  Page 118  |  Page 119  |  Page 120  |  Page 121  |  Page 122  |  Page 123  |  Page 124  |  Page 125  |  Page 126  |  Page 127  |  Page 128  |  Page 129  |  Page 130  |  Page 131  |  Page 132  |  Page 133  |  Page 134  |  Page 135  |  Page 136  |  Page 137  |  Page 138  |  Page 139  |  Page 140  |  Page 141  |  Page 142  |  Page 143  |  Page 144  |  Page 145  |  Page 146  |  Page 147  |  Page 148  |  Page 149  |  Page 150  |  Page 151  |  Page 152  |  Page 153  |  Page 154  |  Page 155  |  Page 156  |  Page 157  |  Page 158  |  Page 159  |  Page 160  |  Page 161  |  Page 162  |  Page 163  |  Page 164  |  Page 165  |  Page 166  |  Page 167  |  Page 168  |  Page 169  |  Page 170  |  Page 171  |  Page 172  |  Page 173  |  Page 174  |  Page 175  |  Page 176  |  Page 177  |  Page 178