news digest ♦ Equipment and Materials
services. EVG’s local teams work hand in hand with our corporate headquarters to provide increased flexibility and capability for our customers. That includes our ability to offer small-scale and pilot-production services at our global applications labs, which is a key differentiator for us and a key value proposition for customers,” he continues to explain.
Expanding sales growth and global customer support operations
During the first half of 2013, EVG achieved approximately 10 percent growth in sales and more than 10 percent increase in employees. To support its customers’ roadmaps, EVG continues to invest aggressively in research and development - approximately 20 percent of sales - in several key efforts.
Among these efforts, EVG has invested in new state-of-the art cleanrooms and application labs with in-house process demo capability on fully automated systems at its corporate headquarters in Austria, as well as its regional headquarters in Japan and North America.
EVG’s dedication to customer service and support was acknowledged when the company was again recognised in VLSIresearch’s annual Customer Satisfaction Survey - this year as one of the 10 BEST Focused Suppliers of Chip Making Equipment.
Wafer bonding
Already a supplier of HVM wafer bonding solutions, EVG recently unveiled several new platform developments in both fusion bonding and temporary bonding/debonding applications.
The firm unveiled the latest version of its EVG40NT automated measurement system, which features improved specifications to achieve the highest wafer-to-wafer alignment accuracies needed for the production of next-generation 3D integrated image sensors.
The EVG40NT is seamlessly integrated with EVG’s GEMINI FB automated production fusion bonding system to enable a closed-loop control system that facilitates customers’ ramp to volume production across multiple markets and applications.
Last week, EVG also introduced its LowTemp debonding platform, which features three high-volume-production room- temperature debonding process types and is supported by a supply chain of seven qualified adhesive suppliers to enable greater manufacturing flexibility.
Lithography and resist processing
Building upon the company’s expertise in lithography, EVG also recently unveiled the EVG120 automated resist processing system, which integrates spin/spray coating and wet processing to provide a highly flexible system that maximises productivity and cost of ownership.
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www.compoundsemiconductor.net August/September 2013
Initiated in 1962 and called the “Oscars of Innovation,” the R&D Awards, issued by R&D Magazine, recognise and celebrate the top 100 technology products of the year.
The SPECTOR-HT is used to create precision thin film coatings for the optical market for applications such as laser machining, telecommunications, manufacturing of laser diodes, heads up displays and laser guidance systems.
“Veeco is honoured to receive this R&D 100 Award that recognises excellence and innovation in technology, and celebrates achievement,” says William J. Miller, Veeco’s Executive Vice President.
“The SPECTOR-HT provides manufacturers the advantages of ion beam sputtering technology - stable deposition rates, high purity, high density and low roughness films; combining for stable low optical loss films - in a robust package that significantly boosts throughput and lowers cost of ownership,” adds Miller.
The EVG120 is ideally suited for a wide variety of markets and applications, including passivation, dielectrics and thick-film processing for compound semiconductor devices.
Rounding out EVG’s latest developments in wafer surface preparation, the company also recently announced the CoatsClean wafer cleaning solution, which combines process, equipment and formulation technology to deliver an innovative, low-cost-of-ownership approach to single-wafer photoresist and residue removal.
Co-developed with Dynaloy, CoatsClean is designed to address thick films and difficult-to-remove material layers for many markets including compound semiconductors.
Veeco wins R&D 100 award
The firm has been awarded for its SPECTOR-HT system which is used to create precision thin film coatings for laser machining, telecoms, laser diode manufacturing and laser guidance systems
Veeco Instruments has been honoured with an R&D 100 Award for its SPECTOR-HT Ion Beam Deposition (IBD) System.
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