Equipment and Materials ♦ news digest
The overall process is based on a high speed full cut laser dicing process for wafers in the range of 150-200µm thick. Due to the specific nature of the applied coating, additional special coating process units were integrated into the system.
As a result, this new system outperformed ALSI’s previous models and a competitors system with significant results. The total cycle time including the specific coating process, multi-beam dicing and wafer cleaning, which are completely integrated in the system, was reduced by almost a factor two.
Since all the process steps are integrated inside the system, the operator cost and handling cost are reduced as well. ALSI says this combination of faster cycle time, reduced handling time, and fast dicing process, also reduced the overall cost per wafer by a factor 2.
The multi-beam process is based on 10-14 beams which achieves a very high dicing speed and a fast process time, while creating an extremely narrow kerf giving superior dicing quality.
This new process and system has been tested by customers resulting in firm orders and is used in full production.
Zygo reveals flexible 3D imaging and surface metrology tool
The Nexview profiler has 3D imaging and measurement system for rapid, precise, quantitative, and interactive surface metrology suited to semiconductor analysis
Zygo’s new 3D profiler metrology tool is suited for both the production and scientific research markets and the company says this it is its all-new flagship product.
SiC mirror showing crystal grains
Using non-contact 3D technology, the system will safely measure fragile and transparent materials without altering the test surface. Its high speed performance, even on steep slopes up to 85 degrees, lets the Nexview profiler save time compared to magnification dependent technologies.
Zygo says the Nexview profiler and its Mx software package produce extremely high fidelity surface topography maps for measuring roughness, flatness, angles, films, steps, and more.
This new software platform acts as a simple to use and learn single interface for system control and data analysis, providing rich interactive 3D maps, quantitative topography information, and intuitive measurement navigation.
Recipe changes are quick and easy with new recipes typically taking only minutes to configure.
What’s more, specialised software modules for measurement in the presence of transparent films and 2D vision analysis are available for expanded functionality.
“As a new concept in surface mapping, the Nexview profiler is a significant leap forward in data collection and interactive surface analysis. These are in high demand for our customers with challenging and high precision requirements. It enables a wide variety of topography applications previously not addressed, and expands our market opportunities,” comments Don Battistoni, Executive Director of Worldwide Sales, Marketing, and Service for Zygo Corporation.
NASDAQ slams Veeco for late quarterly filing
Zygo Nextview 3D profiler
The Nexview profiler is optimised for non-contact surface metrology of an extensive variety of samples and surfaces from the very smooth to the very rough. With sub-nanometre vertical resolution at all magnifications, metrologists need not sacrifice precision for changes in field of view.
The main reason for a delay in filing was down to the company reviewing the timing of the recognition of revenue and related expenses on the sale of some of its products
Veeco Instruments Inc. received a letter from the NASDAQ Stock Market LLC on August 14th, 2013.
It said that Veeco was not in compliance with NASDAQ Listing Rule 5250(c)(1) because its Quarterly Report on Form 10-Q
August/September 2013
www.compoundsemiconductor.net 149
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